2016
DOI: 10.1007/s40799-016-0021-0
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Development of a Non-Resonant 3D Elliptical Vibration Cutting Apparatus for Diamond Turning

Abstract: Machining difficult-to-cut materials has always been a problem to ultraprecision machining due to rapid tool wear. Two-dimensional elliptical vibration cutting (2D EVC) can well alleviate this problem by intermittent cutting motion, but it also has some defects. In this article, a three-dimensional elliptical vibration cutting (3D EVC) apparatus is developed. Four parallel piezoelectric stacks are employed to drive the cutting tool; the tool tip can generate 3D spatial elliptical motions. The spatial positions… Show more

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Cited by 29 publications
(10 citation statements)
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References 15 publications
(11 reference statements)
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“…require the improvement of traditional cutting processes using a hybrid manufacture that consists of combining precision machining with tools vibration (or workpieces) with high frequency and low amplitude [ 12 , 13 ]. Vibration control during machining processes can generate lower average machining forces and thinner chips, leading to high machining efficiency [ 14 ], better tool durability [ 15 ], better quality of the surface and a precise shape, and a reduction of the generation of burrs in the cutting process [ 16 , 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…require the improvement of traditional cutting processes using a hybrid manufacture that consists of combining precision machining with tools vibration (or workpieces) with high frequency and low amplitude [ 12 , 13 ]. Vibration control during machining processes can generate lower average machining forces and thinner chips, leading to high machining efficiency [ 14 ], better tool durability [ 15 ], better quality of the surface and a precise shape, and a reduction of the generation of burrs in the cutting process [ 16 , 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…As a high-performance functional device, the piezoelectric actuator has the advantages of small size, high displacement resolution, fast response speed, compact structure, large driving force, and low cost. Therefore, it has a broad application prospect in the fields of micro-assembly (Heriban et al, 2008), intelligent structure (Gao et al, 2020;Tanaka, 2014), precision machining (Lin et al, 2016), nanotechnology (Gu et al, 2016;Li et al, 2019), bioengineering (Zainal et al, 2015). For example, it is used in the assembly of micro-parts (Schro¨ter and Schmidt, 2018), the probe positioning of scanning probe microscope (Lu et al, 2018), the clamping of cells in bioengineering (Garce´s-Schro¨der et al, 2015;Kim et al, 2008).…”
Section: Introductionmentioning
confidence: 99%
“…Compared to conventional cutting, the cutting force and surface roughness can be reduced with the device. Lu and colleagues 11,12 designed an EVC device with parallel compliant mechanism. The structure is convenient to process, and the driving force is controlled under a lower value.…”
Section: Introductionmentioning
confidence: 99%