Development of a new low-stress hyperred LED encapsulant

Zwiers, R.J.M.; Bressers, H.J.L.; Ouwehand, B.; Baumann, Diana

doi:10.1109/33.35486

Cited by 21 publications

(6 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…6 shows CCT of LED increased from 3050K to 3380K, which shows rapidly alternate temperature influenced on p-n electrodes of LED chip and phosphor powder around LED chip. The heat quantity of solder joints in p-n electrodes cannot be timely dissipated by the heat sink of LED, the heat transfers to the phosphor power through silica gel or resin, which leads to the conversion efficiency of phosphor power [8][9][10][11][12]. Therefore, the reason of the luminous flux and luminous efficiency decreased is found out according to above analysis.…”

Section: Temperature Sumilation Of Ledmentioning

confidence: 99%

“…Nowadays with brightness of LEDs increasing rapidly, it has various applications such as street light, flat panel backlighting, vehicle forward lamp and general illumination [1,2]. The increasing demand for light emitting diodes (LEDs) has been absorbed by a number of application fields, including display backlighting, communications, medical services, signage, and general illumination [3][4][5][6][7][8][9]. When high power LEDs are applied under complex service conditions, especially encounter thermal fluctuations and off and on duty cycles, the cyclical strain and stress are imposed upon its chip, which eventually leads to chip failure.…”

Section: Introduction (Heading 1)mentioning

confidence: 99%

See 1 more Smart Citation

Influence of rapid thermal cycling on optical property and microstructure of high power LED

Chen

Zhou

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

This paper describes the effect of rapid thermal cycling on optical performance of high power light emitting diode (LED) by induction heating. Under an application of induction heating as rapid heating source, the specimens that were being non-operating and operating life tests in the experiment were rapidly heated and cooled based on a control system that employs a fuzzy logic algorithm, respectively. The optical performances, including luminous flux, luminous efficiency and radiant power of two kinds of LED specimens were compared and analyzed. It was found that the rapid thermal cycling have similar evident influence on them. The results showed that the color purity of LED was also descended, the correlated color temperature (CCT) was also risen, but their changing rate and extents are different. The high and low temperature distribution in LED chip was simulated by finite element modeling (FEM) which is helpful for the failure analysis and design of the reliability of the LED packaging. The microstucrue of LED chips are analyzed after different rapid thermal cycling time. The results are showed that rapid thermal cycling can affect greatly the LED properties and interface microstructures. All the results indicate that this approach to rapid thermal cycling by using rapid heating source is feasible to investigate the optical performance of high power LED, so it can also effectively verify the reliability of LED devices.

show abstract

Section: Temperature Sumilation Of Ledmentioning

confidence: 99%

Section: Introduction (Heading 1)mentioning

confidence: 99%

Influence of rapid thermal cycling on optical property and microstructure of high power LED

Chen

Zhou

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

show abstract

“…As an example we choose our own development of a new low-stress encapsulant for Hyperred Light Emitted Diodes (LEDs) [9]. The correlation between chemistry and final optical and mechanical properties of the encapsulant, plus their influence on the lifetime of the LED crystal, is elucidated.…”

Section: Liquid Encapsulantmentioning

confidence: 99%

Correlation between chemistry of polymer building blocks and microelectronics reliability

Bressers

Driel

Jansen

et al. 2007

Microelectronics Reliability

Self Cite

View full text Add to dashboard Cite

“…6 shows CCT of LED increased gradually from 3000K to 3030K, which shows the alternating temperature influenced slightly on p-n electrodes of LED chip and phosphor powder around LED chip. The heat quantity of solder joints in p-n electrodes can be timely dissipated by the heat sink of LED, the heat transfers to the phosphor power through silicon carbide (SiC), which leads to the conversion efficiency of phosphor power [8][9][10][11][12]. Therefore, the reason of the luminous flux and luminous efficiency decreased is found out according to above analysis.…”

Section: Optical Performance With Timementioning

confidence: 99%

Investigation of microstructure and optical property of high power LED based on rapid thermal cycling

Chen

Yin

Jian-ping

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

The objective of this paper is to investigate the effect of rapid thermal cycling on microstructure and optical property (luminous flux and luminous efficiency) of high power light emitting diode (LED) by induction heating. Under an application of induction heating as rapid heating source, the specimens that were being non-operating and operating life tests in the experiment were rapidly heated and cooled based on a control system that employs a fuzzy logic algorithm, respectively. The optical performances, including luminous flux, luminous efficiency and radiant power of two kinds of LED specimens were compared and analyzed. It was found that the rapid thermal cycling have similar evident influence on them. The results showed that the color purity of LED was also descended, the correlated color temperature (CCT) was also risen, but their changing rate and extents are different. The high and low temperature distribution in LED chip was simulated by finite element modeling (FEM) which is helpful for the failure analysis and design of the reliability of the LED packaging. The microstucrue of LED chips are analyzed after different rapid thermal cycling time. The results are showed that rapid thermal cycling can affect greatly the LED properties and interface microstructures. All the results indicate that this approach to rapid thermal cycling by using rapid heating source is feasible to investigate the optical performance of high power LED, so it can also effectively verify the reliability of LED devices.

show abstract

Development of a new low-stress hyperred LED encapsulant

Cited by 21 publications

References 5 publications

Influence of rapid thermal cycling on optical property and microstructure of high power LED

Influence of rapid thermal cycling on optical property and microstructure of high power LED

Correlation between chemistry of polymer building blocks and microelectronics reliability

Investigation of microstructure and optical property of high power LED based on rapid thermal cycling

Contact Info

Product

Resources

About