Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy

Salleh, Mohd Arif Anuar Mohd; McDonald, Stuart D.; Terada, Yasuko; Yasuda, Hideyuki; Nogita, Kazuhiro

doi:10.1016/j.matdes.2015.05.077

Cited by 45 publications

(26 citation statements)

References 43 publications

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“…Some crystalline phases weakened the DFA geopolymer composite's strength. The Fe element exhibited slight changes in the concentration region, mainly because only a small amount of Fe was produced from the raw material (fly ash) [32]. Figure 4 illustrates the XRD pattern of the DFA geopolymer composite before (Control) and after being exposed to 400 and 1000 • C. By referring to Figure 4, y axis was indicated to the various intensity obtained while x-axis represented to diffraction angle of mineral phase appearance.…”

Section: Elemental Distribution Analysismentioning

confidence: 99%

Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature

et al. 2020

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A geopolymer has been reckoned as a rising technology with huge potential for application across the globe. Dolomite refers to a material that can be used raw in producing geopolymers. Nevertheless, dolomite has slow strength development due to its low reactivity as a geopolymer. In this study, dolomite/fly ash (DFA) geopolymer composites were produced with dolomite, fly ash, sodium hydroxide, and liquid sodium silicate. A compression test was carried out on DFA geopolymers to determine the strength of the composite, while a synchrotron Micro-Xray Fluorescence (Micro-XRF) test was performed to assess the elemental distribution in the geopolymer composite. The temperature applied in this study generated promising properties of DFA geopolymers, especially in strength, which displayed increments up to 74.48 MPa as the optimum value. Heat seemed to enhance the strength development of DFA geopolymer composites. The elemental distribution analysis revealed exceptional outcomes for the composites, particularly exposure up to 400 °C, which signified the homogeneity of the DFA composites. Temperatures exceeding 400 °C accelerated the strength development, thus increasing the strength of the DFA composites. This appears to be unique because the strength of ordinary Portland Cement (OPC) and other geopolymers composed of other raw materials is typically either maintained or decreases due to increased heat.

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Section: Elemental Distribution Analysismentioning

confidence: 99%

Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature

et al. 2020

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“…Thus, to reduce the possibility of reinforcement push-out by excessive flux in solder pastes and to obtain a homogenous reinforcement of distribution in the solder matrix, Mohd Salleh et al (2015a) In fabricating solder balls, thin solder sheets were punched using a 2.5 mm diameter metal punch to form a thin solder discs. The thin solder discs were then dipped in a rosin mildly activated (RMA) flux and placed on a Pyrex sheet.…”

Section: 1mentioning

confidence: 99%

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Salleh

McDonald

Nogita

2017

Journal of Materials Processing Technology

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“…Thus, to reduce the possibility of reinforcement push-out by excessive flux in solder pastes and to obtain a homogenous reinforcement of distribution in the solder matrix, Mohd Salleh et al (2015a) have previously developed a method of fabricating a preform TiO2 reinforced solder by a powder metallurgy microwave sintering method. This homogeneous distribution of reinforcement allows the mechanisms of interfacial intermetallic layer suppression to be investigated with more confidence.…”

Section: Sample and Solder Ball Fabricationmentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

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Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

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Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy

Cited by 45 publications

References 43 publications

Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature

Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

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