Development of a Methodology for Strain Field Analysis during Orthogonal Cutting

Meurer, Markus; Augspurger, Thorsten; Tekkaya, Berk; Schraknepper, Daniel; Lima, A; Bergs, Thomas

doi:10.1016/j.procir.2020.03.004

Cited by 19 publications

(8 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The accuracy of the used analytical temperature model has to be enhanced by individually adjusting the heat partition into the workpiece and the width of the moving heat source for individual cutting conditions. The demonstrated FEM models have to be further improved and validated using non integral validation parameters such as strain and strain rate fields [20]. In addition, the impact of the mechanical workpiece loading has to be examined and added to the White Layer prediction model.…”

Section: Discussionmentioning

confidence: 99%

Cutting force based surface integrity soft-sensor when hard machining AISI 4140

Meurer

Tekkaya

Augspurger

et al. 2020

Tm - Technisches Messen

Self Cite

View full text Add to dashboard Cite

Workpiece rim zone modifications during hard machining can be explained with the high thermo-mechanical loads induced by the cutting process. The formation of White Layers with a fine-grained microstructure by dynamic recrystallization (DRX) is one of those surface modifications that can negatively affect the functionality of a machined part by changing the residual stress state and facilitating crack initiation. As a consequence, the fatigue life of the machined parts is reduced. It is therefore of great interest to understand the thermo-mechanical conditions which induce White Layers formation in order to be able to control them by in-situ measurements if necessary. For this purpose, a cutting force based Soft-Sensor is developed in this study which enables the in-process estimation of White Layer thickness. Therefore, a cutting force based analytical model is used to estimate the resulting temperature fields and correlated with validated numerical chip formation simulations. In addition, the predictions of the White Layer thickness of the analytical model are then compared using light microscopy and the results of the numerical finite element model, in which a DRX model is additionally implemented.

show abstract

Section: Discussionmentioning

confidence: 99%

Cutting force based surface integrity soft-sensor when hard machining AISI 4140

Meurer

Tekkaya

Augspurger

et al. 2020

Tm - Technisches Messen

Self Cite

View full text Add to dashboard Cite

show abstract

“…Another well‐organized imaging device for orthogonal cutting analysis was developed by Meurer et al 40 They conducted the experiments on a vertical external broaching machine. As shown in Figure 3A,B, their imaging system includes an sCMOS double‐shutter camera offering a resolution of 2560 × 2160 pixels at a dynamic range A/D of 16 bit and a double‐pulse laser of Quantel EverGreen 70 mJ working at a wavelength of 532 nm at a 15 Hz repetition rate.…”

Section: Imaging Techniquementioning

confidence: 99%

“…(A) Imaging setup of the cutting process and (B) schematic of the acquisition and synchronisation device based on a double‐shutter camera and articulated mirror arm redirected pulsed lasers developed by Meurer et al Reproduced under terms of the CC‐BY license 40 . Copyright 2020, The Authors, published by Elsevier…”

Section: Imaging Techniquementioning

confidence: 99%

Dynamics of chip formation during the cutting process using imaging techniques: A review

Nie

Yang

Zhang

et al. 2022

Int Journal of Mech Sys Dyn

View full text Add to dashboard Cite

Imaging techniques have been widely implemented to study the dynamics of chip formation. They can offer a direct method and a full field measurement of the cutting process, providing kinematic information of the chip formation process. In this article, the state of the art of the imaging techniques reported in the literature has been summarized and analyzed. The imaging techniques have been applied to study the chip formation mechanism, friction behavior, strain/strain rate, and stress fields. Furthermore, the study of surface integrity has been advanced by deriving the thermo‐mechanical loading, subsurface deformation, and material constitutive model from the imaging technique. Finally, achievements in the area of imaging techniques have been summarized, followed by future directions for their application in the study of surface integrity.

show abstract

“…Recently, optical imaging systems have been successfully implemented for in-situ measurement of kinematic fields during machining [23][24][25][26][27]. They offer a real-time insight on the material flow through surface observation of the workpiece.…”

Section: Introductionmentioning

confidence: 99%

Kinematic fields measurement during Ti-6Al-4V chip formation using new high-speed imaging system

Zouabi

Calamaz

Wagner

et al. 2023

Int J Adv Manuf Technol

View full text Add to dashboard Cite

In-situ visualization of the material flow during orthogonal cutting is achieved using new high-speed optical system. Difficulties arise from the submillimetric size of the cutting zone. Therefore, a dedicated optical system was designed allowing for local scale analysis of chip formation. The Digital Image Correlation (DIC) technique is applied on recorded images from the cutting zone to measure the kinematic fields. Then, the effect of the cutting conditions on chip formation is presented with local scale analysis.

show abstract

Development of a Methodology for Strain Field Analysis during Orthogonal Cutting

Cited by 19 publications

References 23 publications

Cutting force based surface integrity soft-sensor when hard machining AISI 4140

Cutting force based surface integrity soft-sensor when hard machining AISI 4140

Dynamics of chip formation during the cutting process using imaging techniques: A review

Kinematic fields measurement during Ti-6Al-4V chip formation using new high-speed imaging system

Contact Info

Product

Resources

About