CCECE 2003 - Canadian Conference on Electrical and Computer Engineering. Toward a Caring and Humane Technology (Cat. No.03CH374
DOI: 10.1109/ccece.2003.1226284
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Development of a MEMS microwave switch and application to adaptive integrated antennas

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Cited by 5 publications
(3 citation statements)
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“…A diamond‐like carbon (DLC, n = 1.9) film was coated on the tip apex with a thickness around 4–5 nm using the plasma enhanced chemical vapor deposition (PECVD) method for protection, and a lubricant layer between the probe and the photoresist 25–28. We also applied a hexamethyldisilazane (HMDS) self‐assembled monolayer (SAMs) to reduce the friction on the photoresist surface,29, 30 so we could achieve high speed scanning faster than 1 mm/s without any surface damage of the photoresist and the optical contact probe.…”
Section: Resultsmentioning
confidence: 99%
“…A diamond‐like carbon (DLC, n = 1.9) film was coated on the tip apex with a thickness around 4–5 nm using the plasma enhanced chemical vapor deposition (PECVD) method for protection, and a lubricant layer between the probe and the photoresist 25–28. We also applied a hexamethyldisilazane (HMDS) self‐assembled monolayer (SAMs) to reduce the friction on the photoresist surface,29, 30 so we could achieve high speed scanning faster than 1 mm/s without any surface damage of the photoresist and the optical contact probe.…”
Section: Resultsmentioning
confidence: 99%
“…Generally speaking, RF MEMS switches are switches that use new MEMS technology, which, compared with the traditional semiconductor switches, possess a series of advantages, such as superior insertion loss and isolation and simple pull-in voltage in radio frequency. For the radar and communication systems, the research on RF MEMS switches is significant [1] .…”
Section: Introductionmentioning
confidence: 99%
“…When HMDS is adsorbed onto a surface with Si-OH groups, it produces a monolayer of methyl groups on the surface, which in turn reduces the tendency of the surface to hydrogen bond. This reduces the influence of secondary bonding forces that contribute to stiction[104,105], Die were handled along the edge, parallel to the waveguides, with flair nosed tweezers to avoid any contact with surface structures or waveguide facets. This also allowed for the horizontal placement and removal of the die into each of the baths of the wet etch procedure as shown in figure 5.35.…”
mentioning
confidence: 99%