Development of a flip-chip composite interconnection system

Abstract

I would like to express my heartfelt gratitude to Prof. John Pang for his guidance, mentorship and invaluable discussions throughout my research. I would like to acknowledge the Singapore Institute of Manufacturing Technology (SIMTech), A*STAR, for sponsoring this research and my special thanks Dr Lim Ser Yong for his constant encouragement. Throughout this research, I received great support from my colleagues from JTG, MMP, MTG and PMG. In particular, I would like to extend my greatest appreciation to Mr Fan Wei for assisting in the test instrumentation, Ms Lu Haijing in the plating evaluations, Dr Yi Ming in the FEM, Mr Cheng Chek Kweng in the assembly setup, Mr Paramasivam in sample preparations and Ms Ng Fern Lan in the SEM. This thesis is dedicated to my beloved wife, Gek Noi, for her unceasing love and devotion to me throughout my academic pursuit, and to my four lovely daughters, Jane, Sarah, Joann and Rayna, for constantly surrounding me with their joy and laughter.