2009
DOI: 10.1016/j.polymdegradstab.2009.06.020
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Development of a DOPO-containing benzoxazine and its high-performance flame retardant copolybenzoxazines

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Cited by 100 publications
(74 citation statements)
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“…Therefore, halogen-free flame retardants have been becoming one of the most promising flame retardants. [1][2][3][4] Non-halogen flame retardants are divided into inorganic and organic flame retardants. Generally, inorganic flame retardants have lower flame retardancy, and a high addition (more than 60 wt %) are needed, but they are less harmful.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Therefore, halogen-free flame retardants have been becoming one of the most promising flame retardants. [1][2][3][4] Non-halogen flame retardants are divided into inorganic and organic flame retardants. Generally, inorganic flame retardants have lower flame retardancy, and a high addition (more than 60 wt %) are needed, but they are less harmful.…”
Section: Introductionmentioning
confidence: 99%
“…Its initial decomposition temperature was 236. 4 C based on 1% mass loss, and its char residue was 41.2 wt % at 600 C, and 22.9 wt % at 800 C, respectively. The flame retardancy and thermal degradation behavior of novel intumescent flame-retardant polypropylene (IFR-PP) composites containing DOPNP were investigated using limiting oxygen index (LOI), UL-94 test, TGA, cone calorimeter (CONE) test, and scanning electron microscopy (SEM).…”
mentioning
confidence: 99%
“…This phenomenon is similar to that observed for previously reported DOPO-containing cured epoxy systems. 25,26 For the epoxy resins incorporating the phosphorus-free reactive modifiers, the C series were more thermally stable than the A series, suggesting again that the thermal stability depends on their different crosslinking densities. Moreover, as revealed in Table II, all of the epoxy resins containing reactive modifiers had relatively higher char yields than did the neat polymers.…”
Section: Synthesis and Characterization Of Reactive Modifiersmentioning
confidence: 99%
“…The disadvantages of the typical Pbzs are the high temperature needed for complete curing and the brittleness of the cured materials that can sometimes limit their potential applications. [8,9] In recent years, the preparation of Pbzs with a low dielectric constant and high performance has become one of the main research focuses. Low-dielectric-constant materials (k < 3.0) have the advantage of facilitating manufacture of high-performance integrated circuit (IC) devices with decreasing feature size of the chip.…”
Section: Introductionmentioning
confidence: 99%