Development of a design library for embedded passive RF components in HDI organic substrate material

Sommer, Grit; Petras, M.; Mohamadou, B.; Salhi, F.; Korf, S.; Fotheringham, Gerhard; Henderson, Rashaunda; Blood, W.; Hwang, Lih-Tyng; Croswell, Robert T.; Lempkowski, Robert; Savic, Jhon; Miller, M.; John, W.; Reichl, H.

doi:10.1109/icsmc2.2003.1429041

2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. 2003

DOI: 10.1109/icsmc2.2003.1429041

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Development of a design library for embedded passive RF components in HDI organic substrate material

Grit Sommer

M. Petras

B. Mohamadou

et al.

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Cited by 6 publications

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“…However, in system-on-package applications, the LTCC technology has two major disadvantages that it has a high fabrication cost and also has a difficulty in dealing with the high-density interconnects. On the other hand, the currently most popular low-cost package substrate is an organic laminate on which the high-density interconnects as well as the high-Q embedded passives are feasible [4]- [8]. But it has only a limited number of layers and the layer thickness is not small enough for realizing largevalue capacitors.…”

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Design of Super-Miniature Bandpass Filters Embedded in the Organic Substrate without Using Large-Value Capacitors

Chiu

Lin

Horng

et al.

56th Electronic Components and Technology Conference 2006

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Very small-size bandpass filters embedded in the organic substrate for wireless front-end applications are presented. Due to the lack of fabrication process for large-value capacitors in the organic substrate, a novel filter prototype using an inductive coupling of series resonators is proposed to achieve high performance within a stringent size constraint. In implementation, the organic bandpass filters are composed of the spiral inductors and parallel-plate capacitors that are embedded in a 4-layer BT laminate, one of today's most popular package substrate. The final realized performance and size are competitive to the LTCC filters but with a much lower cost. IntroductionThe currently available low-temperature cofired ceramic (LTCC) technology can implement high-performance miniature embedded filters quite successfully because of the capability to realize large-value capacitors in a large number of thin substrate layers. To fully employ this capability, most of the LTCC bandpass filter designs adopt a capacitive coupling of parallel resonators as a lumped-element prototype [1]- [3], which mainly uses the large-value vertically interdigitated capacitors in conjunction with the small-value meander-line inductors. However, in system-on-package applications, the LTCC technology has two major disadvantages that it has a high fabrication cost and also has a difficulty in dealing with the high-density interconnects. On the other hand, the currently most popular low-cost package substrate is an organic laminate on which the high-density interconnects as well as the high-Q embedded passives are feasible [4]- [8]. But it has only a limited number of layers and the layer thickness is not small enough for realizing largevalue capacitors. In our literature review, due to the lack of small-volume large-value capacitors, the previously designed bandpass filters embedded in the organic substrate [9]- [12] were inevitably big in size with moderate to high insertion losses in passband. Although a thin high-k dielectric buried in the organic substrate [13], [14] for realizing large-value capacitors is available nowadays, the cost is still too high.A new lumped-element design for the organic bandpass filters without using the large-value capacitors is proposed in this paper. It is based on an inductive coupling of series resonators with components suitable for the large-value spiral inductors in conjunction with the small-value parallel-plate capacitors. In our previous works [15], [16], we have established the scalable model libraries for both types of passive components embedded in a 4-layer BT laminate substrate. When used to design the proposed bandpass filter in the 2.5-2.9 GHz WiMax band, the typical component values are in the range of several nH for the spiral inductors and in

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confidence: 99%

Design of Super-Miniature Bandpass Filters Embedded in the Organic Substrate without Using Large-Value Capacitors

Chiu

Lin

Horng

et al.

56th Electronic Components and Technology Conference 2006

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Passives Technology

2018

3D IC and RF SiPs

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Electrical Design for 5G Hardware—Digital Focus

Hwang¹,

Horng²

2018

3D IC and RF SiPs

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Development of a design library for embedded passive RF components in HDI organic substrate material

Cited by 6 publications

References 2 publications

Design of Super-Miniature Bandpass Filters Embedded in the Organic Substrate without Using Large-Value Capacitors

Design of Super-Miniature Bandpass Filters Embedded in the Organic Substrate without Using Large-Value Capacitors

Passives Technology

Electrical Design for 5G Hardware—Digital Focus

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