2008 10th Electronics Packaging Technology Conference 2008
DOI: 10.1109/eptc.2008.4763464
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Development of a 65nm Cu/low-k Stack Die FBGA Package for SiP Applications

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Cited by 1 publication
(3 citation statements)
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“…Mohamed Mamdouh M. Ali 1* , Shoukry I. Shams 2 , Mahmoud Elsaadany 3 , Ghyslain Gagnon 3 & Ke Wu 4 Graphene-based microwave devices have enabled reconfigurability, thus paving the way to the realization of flexible wireless terahertz systems with featured performances. Despite great progress in the development of graphene-based terahertz devices in the literature, high insertion loss and wide tunable range are still significant challenges at such high frequencies.…”
Section: Graphene-based Terahertz Reconfigurable Printed Ridge Gap Wa...mentioning
confidence: 99%
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“…Mohamed Mamdouh M. Ali 1* , Shoukry I. Shams 2 , Mahmoud Elsaadany 3 , Ghyslain Gagnon 3 & Ke Wu 4 Graphene-based microwave devices have enabled reconfigurability, thus paving the way to the realization of flexible wireless terahertz systems with featured performances. Despite great progress in the development of graphene-based terahertz devices in the literature, high insertion loss and wide tunable range are still significant challenges at such high frequencies.…”
Section: Graphene-based Terahertz Reconfigurable Printed Ridge Gap Wa...mentioning
confidence: 99%
“…Reconfigurable systems can be constructed through deploying sub-systems having the ability to reversibly change their functionality under some controlling process. One of the major revolutions of reconfigurability in electronics is the field-programmable gate array (FPGA), which has a powerful impact on digital design methodologies alongside wireless systems 2,3 . In a related context, few trials are initiated to develop reconfigurable microwave components providing an additional level of functionality for wireless systems.…”
Section: Graphene-based Terahertz Reconfigurable Printed Ridge Gap Wa...mentioning
confidence: 99%
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