Development and Prospect of Coaxial Through-Silicon Via in 3D Integrated Circuits

Junkai, Ma; Guangbao, Shan; Guoliang, Li; Zheng, Liu; Weihua, Fan

doi:10.1109/icept59018.2023.10492005

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492005

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Development and Prospect of Coaxial Through-Silicon Via in 3D Integrated Circuits

Ma Junkai,

Shan Guangbao,

Li Guoliang

et al.

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Development and Prospect of Coaxial Through-Silicon Via in 3D Integrated Circuits

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References 25 publications

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