Development and Investigation of Tungsten Copper Sintered Parts for Using in Medium and High Voltage Switching Devices

Lungu, M.; Lucaci, Mariana; Tsakiris, Violeta; Brătulescu, A.; Cîrstea, C. D.; Marin, Mihaela; Pătroi, Delia; Mitrea, Sorina; Marinescu, Virgil; Grigore, F.; Tălpeanu, Dorinel; Stancu, N.; Godeanu, P.; Melnic, C

doi:10.1088/1757-899x/209/1/012012

Cited by 13 publications

(20 citation statements)

References 23 publications

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“…In this aim, uniaxial pressing of elemental powder mixtures, sintering and Cu infiltration of W based skeletons under protective hydrogen and nitrogen atmosphere were performed in modified conditions described by us elsewhere [8]. After Cu excess removing by mechanical polishing, the both circular surfaces of the disk samples were finished to obtain a surface roughness with Ra of 0.10…0.16 µm and Rz of 0.7…1.4 µm.…”

Section: Methodsmentioning

confidence: 99%

“…Equipment and testing conditions are detailed in other paper published by us [8]. Mean values of ten measurements performed in ambient air at 30±2 °C and humidity of 32±3% are presented further for hardness (H IT , HV IT ), Young's modulus (E IT ), contact stiffness (S), elastic and plastic behavior of indentation work and creep indentation (C IT ).…”

Section: Methodsmentioning

confidence: 99%

“…When W content increase, the resistance to wear and arc erosion will increase but the thermal and electrical conductivity will reduce due to Cu content decrease. W-Cu composites have good mechanical properties and high resistance to contact wear, welding, and melting at high currents and voltages [1,[3][4][5][6][7][8][9][10][11][12][13][14]. These superior properties recommend W-Cu composites as arcing contacts in medium and high voltage circuit breakers operating at high contact pressures in SF 6 gas or mineral oil.…”

Section: Introductionmentioning

confidence: 99%

“…% ultrafine or fine particles of W, and balance is composed of Cu and up to 1…3 wt. % sintering activator (Ni, Fe, Co, or other transition element) [3][4][5][6][7][8]14]. Pressing, sintering, and infiltration (PSI) technique is one of the common techniques used for manufacturing W-Cu composites containing over 50 wt.…”

Section: Introductionmentioning

confidence: 99%

“…% W for power switching applications. PSI technique consists in infiltration at 1100…1400 °C with molten Cu into W based skeleton that was previously pressed to certain porosity and sintered at 800…1000 °C [3][4][5][6][7][8]. Consequently, highly dense copper infiltrated tungsten composites are obtained.…”

Section: Introductionmentioning

confidence: 99%

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Tribological Behavior of Arcing Contact Materials Based on Copper Infiltrated Tungsten Composites

Lungu

Enescu

Lucaci

et al. 2017

Proccedings of International Scientific Conference "BALTTRIB 2017"

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Tungsten copper composites with 70±3 wt.% W, maximum 1.5 wt.% Ni, and balance Cu were achieved as disks (diameter × height of 50×6 mm) by copper infiltration process of tungsten skeletons. Elemental analysis was assessed by WDXRF spectroscopy. Hydrostatic density was evaluated in ethanol. Vickers hardness and Young's modulus were determined in ambient air by instrumented indentation technique and Oliver&Pharr computation method. Tribological behavior was investigated under 30 N up to 400 m sliding distance and naphthenic mineral oil lubricant with a standard tribometer of ball-on-disk type. The results yielded highly dense materials with relative density over 96%, Vickers hardness (HV IT ) of 244…323, Young's modulus (E IT ) of 156…185 GPa, mean coefficient of friction of 0.11…0.22 and specific wear rate up to 8×10 -6 mm 3 /(Nm). The developed composites with low coefficient of friction and high wear resistance for use as arcing contacts in oil circuit breakers will endow high performance in service.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Tribological Behavior of Arcing Contact Materials Based on Copper Infiltrated Tungsten Composites

Lungu

Enescu

Lucaci

et al. 2017

Proccedings of International Scientific Conference "BALTTRIB 2017"

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A critical review on spark plasma sintering of copper and its alloys

et al. 2021

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Copper and its alloys have been in the service of humankind earlier than any other metal throughout history. In the present review, all aspects of the SPS of copper and its alloys are comprehensively investigated, and their potential effects on the microstructure and properties of alloys are thoroughly reviewed. In this regard, the densification phenomenon during SPS treatment is fully investigated. The effects of raw powder characteristics involving particle size, contamination content, and powder morphology on the sinterability of these materials are examined. Then, the influence of SPS operation parameters consisting of pressure, heating rate, dwelling time, pulsed electrical current, electrical pulses pattern, sintering temperature, and sintering tooling on densification of these materials is extensively discussed. Furthermore, the microstructure evolution and grain growth behaviors during SPS are explored. In addition, current challenges and future perspectives of this field are addressed.

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Regularities of Structure Formation During Friction Stir Processing of CuAl9Mn2 Copper Alloy with Addition of Tungsten Powder to the Surface Layer

et al. 2022

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Development and Investigation of Tungsten Copper Sintered Parts for Using in Medium and High Voltage Switching Devices

Cited by 13 publications

References 23 publications

Tribological Behavior of Arcing Contact Materials Based on Copper Infiltrated Tungsten Composites

Tribological Behavior of Arcing Contact Materials Based on Copper Infiltrated Tungsten Composites

A critical review on spark plasma sintering of copper and its alloys

Regularities of Structure Formation During Friction Stir Processing of CuAl9Mn2 Copper Alloy with Addition of Tungsten Powder to the Surface Layer

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