Development and characterization of environmentally friendly multifunctional protective coatings

Exarchos, Dimitrios A.; Sima, Artemis Dimitra; Ananiadis, Ilias; Dalla, Panagiota Aikaterini; Tragazikis, Ilias Κ.; Kordatou, Theodoti; Farmaki, Spyridoula; Gontzamanis, Anastasios; Kechagias, Vasileios; Kechagias, Loisos; David, Constantine; Matikas, Theodore E.

doi:10.1117/12.2614989

Cited by 1 publication

(1 citation statement)

References 16 publications

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“…In order to be able to use them, it is necessary that these circuits are properly packaged. Their packaging usually provides a variety of functions [ 10 , 11 , 12 , 13 ], such as protection from environmental factors, as any chemical changes may reduce the efficiency of the circuit, as well as mechanical strength and heat management both to increase the reliability and service life of the circuit and to prevent material damage [ 14 ]. The circuit also needs to be interconnected with the packaging to enable its interaction with a user, another circuit, or a larger system.…”

Section: Introductionmentioning

confidence: 99%

Packaging and Optimization of a Capacitive Biosensor and Its Readout Circuit

Georgas

Nestoras

Kanaris

et al. 2023

Sensors

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In pipeline production, there is a considerable distance between the moment when the operation principle of a biosensor will be verified in the laboratory until the moment when it can be used in real conditions. This distance is often covered by an optimization and packaging process. This article described the packaging and optimization of a SARS-CoV-2 biosensor, as well as the packaging of its electronic readout circuit. The biosensor was packed with a photosensitive tape, which forms a protective layer and is patterned in a way to form a well in the sensing area. The well is meant to limit the liquid diffusion, thereby reducing the measurement error. Subsequently, a connector between the biosensor and its readout circuit was designed and 3D-printed, ensuring the continuous and easy reading of the biosensor. In the last step, a three-dimensional case was designed and printed, thus protecting the circuit from any damage, and allowing its operation in real conditions.

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