Development and characterization of a monolithic ceramic pre-package for SiC-semiconductor devices based on LTCC technology

Lenz, Christian; Ziesche, Steffen; Reinhardt, Kathrin; Körner, Stefan; Schletz, Andreas; Bach, Hoang Linh; Schmidt, Ingo; Simon-Naiasek, Michel

doi:10.1109/estc55720.2022.9939430

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Ltcc Embedding Echnology T1

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“…3) without . Additionally, we evaluated the electrical interconnections of LTCC pre-packages w ith integrated SiC chips of different power metallizations ( ) Table II by measuring the resistance between top and bottom side of the package [7], [8]. For best package performance the resistance should be similar to the resistance of the ohmic dummy SiC dies (< 1 Ω).…”

Section: Ltcc Embedding Echnology Tmentioning

confidence: 99%

Ceramic Embedding of SiC-Semiconductor Using Cofiring Technology

Ziesche,

Reinhardt,

Varghese

et al. 2024

IMAPSource Proceedings

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The presented work demonstrates our current state in embedding of SiC power electronic dies using Ceramic Multilayer Technology. The novelty of the approach presented includes the cofiring of a semiconductor element with ceramic base material, which demands for a reduced sintering temperature of ceramics (using LTCC or ULTCC based ceramics) in combination with an increased temperature stability of the semiconductor.

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Section: Ltcc Embedding Echnology Tmentioning

confidence: 99%