Development and characterization of a multilayer silver/silver-tantalum oxide thin film coating on stainless steel for biomedical applications

Alias, Rodianah; Mahmoodian, Reza; Shukor, Mohd Hamdi Abd

doi:10.1016/j.ijadhadh.2019.04.010

Cited by 44 publications

(13 citation statements)

References 36 publications

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“…In particular, Ti-based intermetallic thin films could combine promising biocompatibility and high durability [ 18 , 20 ]. Among several available techniques, physical vapor deposition (PVD), e.g., sputtering, is one of the most commonly used techniques to coat implants [ 21 ], as the films produced by the sputtering process have very low surface roughness, which also play an important role on biofilm adhesion on Ti-based thin films [ 22 , 23 , 24 ]. The addition of several metallic elements during processing can improve the properties of pure Ti by the formation of intermetallic compounds.…”

Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

et al. 2021

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In this work, the ternary titanium, copper, and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition—magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by X-ray diffraction (XRD), nanoindentation (modulus and hardness), to quantitatively evaluate the scratch adhesion, and atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick, and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness, respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (−36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

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Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

et al. 2021

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“…Among several available techniques, physical vapor deposition (PVD), e.g. sputtering, is one of the most commonly used technique to coat the implant [21] as the films produced by sputtering process have very low surface roughness, which also play an important role on biofilm adhesion on Ti-based thin films [22][23][24]. The addition of several metallic elements during processing can improve the properties of pure Ti by the formation of intermetallic compounds.…”

Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Rashid¹,

Sebastiani²,

Mughal³

et al. 2021

Preprint

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In this work, the ternary titanium, copper and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition-magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by x-ray diffraction (XRD), nanoindentation (modulus and hardness) and Atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (-36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

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“…Nowadays, there is substantial scientific interest in the engineering and characterization of unconventional nanocomposite materials for various applications, ranging from construction to technological discovery [1][2][3][4][5][6][7]. Solar windows, and in particular, large-area transparent luminescent solar concentrators (LSC), have recently been receiving increasing attention in the field of photovoltaic (PV) devices and systems.…”

Section: Introductionmentioning

confidence: 99%

Physical Vapor-Deposited Silver (Ag)-Based Metal-Dielectric Nanocomposites for Thin-Film and Coating Applications

Nur-E-Alam

Basher

Vasiliev³

et al. 2021

Applied Sciences

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Metallic thin-film materials and nanoparticles (mainly silver (Ag)-based) are recently being used in many nano-technological applications, including sensors, reflective heat-mirror coatings, and antibacterial coatings. The physical vapor deposition technique has attracted significant attention for Ag-based nanocomposites with tailoring of the structural and optical properties of metallic thin films, thus allowing for further improvements and application possibilities in various existing fields, namely electronics, catalysis, magnetics, and optics, alongside the environment and health and new emergent fields, particularly thin-film coatings. This study highlights the preparation, characterization, properties, and possible future application directions of several types of silver (Ag)-based nanocomposite thin films prepared by using physical vapor deposition techniques. The high-temperature (above 300 °C) heat-treated composite layer shows significant spectral shifts; however, distinguishingly notable sizes of nanoparticles are not observed, which indicates that this newly developed composite material can be useful for various coating applications.

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Development and characterization of a multilayer silver/silver-tantalum oxide thin film coating on stainless steel for biomedical applications

Cited by 44 publications

References 36 publications

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Physical Vapor-Deposited Silver (Ag)-Based Metal-Dielectric Nanocomposites for Thin-Film and Coating Applications

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