2017
DOI: 10.15587/1729-4061.2017.92551
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Development and analysis of mathematical models for the process of thermal conductivity for piecewise uniform elements of electronic systems

Abstract: IntroductionOf particular importance in the production of electronic devices are composite materials, development of which is one of the leading challenges of modern materials science. The emergence of new composite materials with improved operational physical-mechanical properties will contribute to the creation of new technologies in aviation, space, shipbuilding, energy, electronic industries, machine building and transport. Among the composite materials, important place is occupied by the structures with f… Show more

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