Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization

Seike, Yoshiyuki; DeNardis, Darren; Sugiyama, Masano; Miyachi, Keiji; Doi, Toshiro; Philipossian, Ara

doi:10.1143/jjap.44.1225

Cited by 16 publications

(6 citation statements)

References 26 publications

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“…HPMJ technology has been evaluated previously on polyurethane ͑Rohm and Haas IC1000͒ as well as soft pads ͑Rohm and Haas SUBA IV͒. 4,5 These studies have confirmed that HPMJ conditioning can clean the pad surface. Other studies have further shown that HPMJ results in lower ILD RRs ͑compared to diamond disk conditioning͒ as a result of slurry dilution inside and on the pad.…”

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confidence: 83%

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

Seike¹,

Lee

Takaoka³

et al. 2006

J. Electrochem. Soc.

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Diamond conditioning was compared to an alternative method, namely high-pressure micro jet ͑HPMJ͒ conditioning, through a series of interlayer dielectric chemical mechanical planarization ͑ILD CMP͒ marathon tests. The two systems were compared individually and in combination on the basis of ILD removal rate ͑RR͒, coefficient of friction ͑COF͒, and the physical appearance of the pad surface ͑both on the top areas as well as inside the grooves͒. Results indicated that diamond conditioning alone was effective in causing RR and COF stability during extended runs, but it could not clean the slurry residues and other by-products from the surface of the pad ͑especially inside the grooves͒. Results also showed that HPMJ conditioning was able to effectively clean the pad surface, despite not providing enough energy to abrade the surface of the pad and maintain constant RR and COF during extended polishing. Based on these findings, a new pad conditioning method based on a combination of diamond and HPMJ conditioning was proposed. Results showed that this new method allowed for stable polish results in terms of RR and COF during extended marathon runs, and also yielded substantially residue-free surfaces, which could extend pad life and reduce wafer-level defect.

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confidence: 83%

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

Seike¹,

Lee

Takaoka³

et al. 2006

J. Electrochem. Soc.

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“…The results showed that when using the HPMJ method to condition polishing pads, the same conditioning effect as the traditional conditioning can be obtained in half the processing time; moreover, the polishing pad conditioning efficiency and pad life are improved compared to the traditional method. SEIKE et al [ 21 ] studied the effect of experimental parameters such as nozzle speed on the conditioning results. Moreover, they analyzed the kinetic energy range of water droplets ejected from the HPMJ system and its effect on the surface of the polishing pad.…”

Section: Introductionmentioning

confidence: 99%

CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Wang

Chen

et al. 2023

Micromachines

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In this study, in order to improve and restore the performance of the polishing pads and reduce the cost of chemical mechanical polishing, three types of material polishing pads, namely, polyurethane, damping cloth, and non-woven fabric, were selected for the experiment. Accordingly, each polishing pad was set up with diamond conditioner and high-pressure micro-jet (HPMJ) conditioning control experiments. Subsequently, the fluctuation ranges of the material removal rate on the three polishing pads were 2.73–3.75 μm/h, 1.38–1.99 μm/h, and 2.36–4.32 μm/h, respectively under the HPMJ conditioning method, while the fluctuation ranges of the material removal rate on the three polishing pads were 1.80–4.14 μm/h, 1.02–2.09 μm/h, and 1.78–5.88 μm/h under the diamond conditioning method. Comparing the polishing pad morphologies under SEM, we observed that the surface of the polishing pad after HPMJ conditioning was relatively clean, and the hole structure was not blocked. Contrastingly, there remained numerous abrasive particles on the surface after the conventional diamond conditioning and the hole structure was blocked. Thus, the HPMJ conditioning technology is better than the traditional diamond conditioning technology. Subsequently, the polishing pad after HPMJ conditioning has a longer service life and a more stable material removal rate than that after traditional diamond conditioning.

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“…1) In the manufacturing process of semiconductor devices, cleaning of the devices is one of the key technologies to ensure their quality. [2][3][4] The normal way of cleaning semiconductor device has been to dip the devices in a chemical liquid, as seen in RCA clean developed by Radio Corporation of America, to remove unnecessary fine particles and films. However, as the diameters of the silicon wafers increase, a singlewafer transfer-type cleaning, in which the devices are cleaned one by one to eliminate unevenness of cleaning and to achieve the requirement for shorter process time, is being used.…”

Section: Introductionmentioning

confidence: 99%

Silicon Wafer Cleaning Using New Liquid Aerosol with Controlled Droplet Velocity and Size by Rotary Atomizer Method

Seike¹,

Miyachi

Shibata³

et al. 2010

Jpn. J. Appl. Phys.

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Numerical experiments on two-dimensional convection with or without a vertical magnetic field reveal a bewildering variety of periodic and aperiodic oscillations. Steady rolls can develop a shearing instability, in which rolls turning over in one direction grow at the expense of rolls turning over in the other, resulting in a net shear across the layer. As the temperature difference across the fluid is increased, two-dimensional pulsating waves occur, in which the direction of shear alternates. We analyse the nonlinear dynamics of this behaviour by first constructing appropriate low-order sets of ordinary differential equations, which show the same behaviour, and then analysing the global bifurcations that lead to these oscillations by constructing one-dimensional return maps. We compare the behaviour of the partial differential equations, the models and the maps in systematic two-parameter studies of both the magnetic and the non-magnetic cases, emphasizing how the symmetries of periodic solutions change as a result of global bifurcations. Much of the interesting behaviour is associated with a discontinuous change in the leading direction of a fixed point at a global bifurcation; this change occurs when the magnetic field is introduced.

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Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization

Cited by 16 publications

References 26 publications

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Silicon Wafer Cleaning Using New Liquid Aerosol with Controlled Droplet Velocity and Size by Rotary Atomizer Method

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