Developement of 3D Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)

Deputch, G.; Shochet, M.; Lipton, R.; Wu, Jinyuan; Patti, G.; Drake, G.; Demarteau, M.; Tang, Furong; Patti, B.; Ramberg, E.; Amerio, S.; Hoff, J.; Olsen, J.; Yarema, R.; Liu, T.; Zhang, H.

doi:10.2172/1031164

Cited by 2 publications

(1 citation statement)

References 14 publications

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“…The possibility of employing this technology for sensor fabrication is at the forefront of solid state detector developments, opening the possibility of fabricating sensor, amplifier, digital processor in separate, optimized processes, and then stacking them together after reducing the single chip thickness to 10 µm or less. Besides the advantage of improving the performance of traditional detectors, this vertical integration technologies can also be used to design smart detectors [17], in which multiple hits are combined locally, possibly measuring track segments instead of single points, and providing crucial information to resolve the trigger and event overlap problems at high luminosity LHC [18].…”

Section: Pos(eps-hep 2013)147mentioning

confidence: 99%

Detector R&D

Forti¹

2014

Proceedings of the European Physical Society Conference on High Energy Physics — PoS(EPS-HEP 2013)

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Detectors are they eyes with which we observe the physics and explore new phenomena. The development of more performing detectors is essential for future physics discoveries and requires appropriate attention, funding, and recognition. In this paper the current trends in High Energy Physics detector research and development are reviewed. Since the topic is broader than the available space, figures are not included in the paper, but can be found in the references, whose main sources are the recent instrumentation conferences [1 -6].

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Section: Pos(eps-hep 2013)147mentioning

confidence: 99%