Determination of vanadium(V) by direct automatic potentiometric titration with EDTA using a chemically modified electrode as a potentiometric sensor

Quintar, Silvya; Santagata, J. P.; Cortinez, V.A.

doi:10.1016/j.talanta.2005.04.010

Cited by 12 publications

(6 citation statements)

References 3 publications

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“…From academic viewpoints, however, EDTA is widely used in alloy plating and heavy metal sensors due to its strong chelating ability to most metallic ions in a wide pH range. 4,31,32 Moreover, this work mainly focuses on how the pulse deposition improves the composition control of Sn-Bi alloys. Accordingly, the effects of EDTA, CA, and PEG concentrations on the composition and morphology of Sn-Bi deposits are not investigated here.…”

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confidence: 99%

Composition and Microstructure Control of Tin-Bismuth Alloys in the Pulse Plating Process

Tsai

2011

J. Electrochem. Soc.

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Pulse plating of Sn-Bi alloys were investigated from a bath containing three compounds, including citric acid (CA), ethylenediaminetetraacetic acid (EDTA), and polyethylene glycol (PEG400) at pH = 1. Based on the linear sweep voltammetric (LSV) analysis, the large gap in the onset deposition potential between Sn and Bi metals led to displacement deposition at the interface between metallic Sn atoms and Bi3+ ions in the time-off (toff) period. Consequently, the pulse-plating parameters (i.e., duty percentage in the pulse cycle and pulse frequency) were adjusted to affect the double-layer charging effect and the mass transport process to control the composition and morphology of alloys. This pulse plating method provides a reliable route to obtain uniform Sn-Bi alloys of high Sn contents (e.g., 80Sn-20Bi and 90Sn-10Bi) and the eutectic 42Sn-58Bi deposit. Various Sn-Bi deposits were characterized by the scanning electron microscopic (SEM), energy-dispersive spectroscopic (EDS), and X-ray diffraction (XRD) analyses.

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Composition and Microstructure Control of Tin-Bismuth Alloys in the Pulse Plating Process

Tsai

2011

J. Electrochem. Soc.

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“…From academic viewpoints, however, EDTA is widely used in alloy plating and heavy metal sensors due to its strong chelating ability to most metal ions in a wide pH range. 19,23,24 One of the purposes of this work is to show how to evaluate the interactive effects of wetting and complexing agents on the composition of an alloy consisting of two metals with a large gap in the equilibrium deposition potential, which is applicable to other alloy systems.…”

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confidence: 99%

Composition Control of Sn–Bi Deposits: Interactive Effects of Citric Acid, Ethylenediaminetetraacetic Acid, and Poly(ethylene glycol)

Tsai

2009

J. Electrochem. Soc.

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Interactive effects of complex agents, including citric acid ͑CA͒, ethylenediaminetetraacetic acid ͑EDTA͒, and poly͑ethylene glycol͒ ͑PEG͒ on the electroplating behavior of Sn-Bi deposits from a basic bath containing 0.15 M Sn 2+ and 0.05 M Bi 3+ with pH 2, were systematically compared by linear sweep voltammetry ͑LSV͒ analyses. The onset potential of Bi deposition is obviously shifted to a negative value close to that of Sn deposition by the simultaneous addition of the above three compounds into the basic plating solution. Based on the LSV results, the composition of Sn-Bi deposits with Sn varying from 44 to 96 wt % can be controlled by varying the current density of electroplating and the concentration of EDTA from the basic plating bath containing 0.3 M CA and 0.2 M PEG. This plating bath provides a reliable route to obtain Sn-Bi alloys of high Sn content ͑e.g., 80Sn-20Bi and 90Sn-10Bi͒ and the eutectic 42Sn-58Bi deposit. Tin-bismuth deposits plated from the basic bath with different combinations of the above three complex agents were also characterized by scanning electron microscopic and energy-dispersive spectroscopic analyses.Attention has been paid to flip-chip technology for microchip packaging and high level system assembly, owing to several benefits such as excellent electrical performance, small package size ͑as chip size͒, good heat removal, and improved signal integer for high speed or high frequency designs. 1 Based on these advantages, Sn-Pb solder bumps, as the first priority of flip-chip interconnection proposed by IBM, have been widely recognized as the most prominent material for interconnecting and packing electronic components. 2 However, due to environmental consideration and the toxicity of lead in Sn-Pb solders, the European Union declared that the usage of lead component has to be limited in many of the electronic assembly processes on July 1, 2006 3-7 although Sn-Pb solders are the most extensively used solder bumps in electronic packaging. Consequently, developing the substitutes, lead-free solder alloys, for electronic applications becomes an urgent assignment in the electronic assembly industry.There are several types of lead-free solder materials ͑e.g., SnCu, Sn-Ag, Sn-Bi, Sn-Ag-Cu, Sn-Zn, Sn-Zn-Bi, etc.͒ with distinct physicochemical properties for the electronic assembly industry, which have been found to strongly depend on the metal type as well as their composition. 3-13 There is a renewed interest in employing the Sn-Bi system with/without the addition of other elements because of the merits of the eutectic 42Sn-58Bi solder bumps with a low reflowing temperature ͑a eutectic point of 139°C͒, good joint strength, low surface tension, excellent creep resistance, high shear strength, good anticorrosive properties, etc., 3,4,7,14,15 although this system has been used for over 20 years in assembling mainframes. 7 Besides, 80Sn-20Bi and 90Sn-10Bi with their melting points of 185 and 200°C, respectively, were reported to replace the eutectic Sn-Pb solder bumps because of the similar m...

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“…Conventional detection techniques such as potentiometric titration 39 and mass spectrometry 40 have disadvantages such as complicated operating procedures when they are used for the online detection of VFB electrolytes. Experimental and simulation studies have been devoted for detecting the state of charge (SOC) of VFBs by using their open circuit voltages (OCVs).…”

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confidence: 99%

A low-cost average valence detector for mixed electrolytes in vanadium flow batteries

Zhang

et al. 2018

RSC Adv.

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Determination of vanadium(V) by direct automatic potentiometric titration with EDTA using a chemically modified electrode as a potentiometric sensor

Cited by 12 publications

References 3 publications

Composition and Microstructure Control of Tin-Bismuth Alloys in the Pulse Plating Process

Composition and Microstructure Control of Tin-Bismuth Alloys in the Pulse Plating Process

Composition Control of Sn–Bi Deposits: Interactive Effects of Citric Acid, Ethylenediaminetetraacetic Acid, and Poly(ethylene glycol)

A low-cost average valence detector for mixed electrolytes in vanadium flow batteries

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