Determination of the thermal endurance of PCB FR4 epoxy laminates via thermal analyses

Polanský, Radek; Prosr, Pavel; Cermak, Michal

doi:10.1016/j.polymdegradstab.2014.03.043

Cited by 24 publications

(9 citation statements)

References 29 publications

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“…Nevertheless, the application of traditional epoxy resin products is limited due to its inherent high brittleness, poor crack resistance, and weak impact resistance 6 . In addition, with the continuous development of advanced microelectronics technology, the development of lead‐free solders that require higher reflow temperature has become an inevitable trend, which also puts forward higher requirements for the thermal performance of epoxy resins commonly used in microelectronic packaging 7,8 . Typically, various elastomers with flexible molecular chains have been proven to efficiently improve the favorable toughness of epoxy resins, 9–12 but some of these epoxy‐based products usually suffer from the low tensile strength and deteriorated thermal performance.…”

Section: Introductionmentioning

confidence: 99%

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

2021

J of Applied Polymer Sci

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Achieving synergetic improvements of mechanical strength, toughness, and thermal stability of epoxy resin has been a crucial but very challenging issue. Herein, to explore a new solution for circumventing this issue, polyimide microspheres were successfully prepared through the inverse nonaqueous emulsion process, and the structure, size distribution and morphologies of polyimide (PI) microspheres were comprehensively investigated. Then the PI microspheres were incorporated in epoxy resin matrix to systematically investigate the mechanical and thermal properties of obtained epoxy/PI microspheres composites. It was found that the PI microspheres can not only enhance the mechanical strength of epoxy resin, but also significantly improve the toughness. Specially, the epoxy‐based composites containing 3 wt% PI microspheres exhibit a 47% increase in tensile strength, while the GIC and Charpy impact strength increase by 106% and 200%, respectively. The toughing mechanism of epoxy/PI microspheres composites was discussed. Moreover, the PI microspheres can also endow the epoxy resin with excellent thermal stability and heat resistance. Thus, this work may open a new opportunity to synergistically enhance the mechanical and thermal properties of epoxy‐based composites and may also give some valuable inspiration for the rational design of other high‐performance thermosetting composites.

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Section: Introductionmentioning

confidence: 99%

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

2021

J of Applied Polymer Sci

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“…Nevertheless, previous studies about PCB aging and thermal endurance of FR-4 suggest that detrimental thermo-oxidative reactions are insignificant for such small periods of time such as that used in Figure 2b. 46,47 Thus, alternative substrates such as ceramics or polyimides could be used to investigate the performance of these thermistor devices at higher temperatures. 46 In Figure 2c, the 3.5 wt % graphene thermistor is kept for 1 h at 100, 150, and 170 °C.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

Graphene-Enhanced Screen-Printed BiFeO₃-Based Thermistors

Fourmont

Yin

Fortier

et al. 2022

ACS Appl. Electron. Mater.

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In this study, serigraphic-grade BiFeO3-based ink formulations are produced and then mixed with graphene to enhance the performances of screen-printed thermistor devices. The devices are printed atop a standard thermally boosted glass-reinforced epoxy (FR-4) substrate coated with interdigitated gold electrodes. The broader operating temperature range of these thermistors makes them compatible with standard printed circuit board (PCB) manufacturing and operating conditions. Thus, we achieve highly sensitive devices with a temperature coefficient of resistance (TCR) of −0.96%/°C, which is the highest sensitivity reported yet for any graphene-based thermistor operating from 25 to 170 °C. The best-performing devices are loaded with 3.5 wt % graphene. These low-hysteresis and stable thermistors boast a thermal index (β-coefficient) of 864 K. This optimal graphene loading occurs just above the percolation threshold.

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“…6, and shows the extend of the swelling. The formation of blisters is probably a conjunction of the rubbery state of the FR4 maintained above its T G , and of the thermo-oxidation of the epoxy caused by the diffusion of oxygen [13]. It might also be related to other compounds included in the polymer, such as bromide flame retardant [9], which were found to have a detrimental effect at high temperature in [6].…”

Section: Discussionmentioning

confidence: 99%

Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

Aviñó-Salvadó

Sabbah

Buttay

et al. 2017

Journal of Microelectronics and Electronic Packaging

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This article presents the long term (1000 h) behaviour of two printed-circuit board materials (Panasonic R1755V, a high-T G glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190°C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week).Almost no degradation is observed for both materials, when stored in nitrogen. On the contrary, the board stored in air show the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 weeks, because of large swelling.

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Determination of the thermal endurance of PCB FR4 epoxy laminates via thermal analyses

Cited by 24 publications

References 29 publications

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

Graphene-Enhanced Screen-Printed BiFeO₃-Based Thermistors

Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

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Determination of the thermal endurance of PCB FR4 epoxy laminates via thermal analyses

Cited by 24 publications

References 29 publications

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

Synergistic improvement of mechanical and thermal properties in epoxy composites via polyimide microspheres

Graphene-Enhanced Screen-Printed BiFeO3-Based Thermistors

Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

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Product

Resources

About

Graphene-Enhanced Screen-Printed BiFeO₃-Based Thermistors