Determination of the interface properties in an elastic film/substrate system

Yin, Hanbin; Liang, Lihong; Wei, Yueguang; Peng, Zhilong; Chen, S.H.

doi:10.1016/j.ijsolstr.2020.01.003

Cited by 25 publications

(3 citation statements)

References 44 publications

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“…Therefore, they adopted three approaches to analyze the DCB experiments. Yin et al proposed a new method for simultaneously determining the strength and toughness of the interface, as long as the maximum peel force, steady-state peel force and bending stiffness of the film are obtained from the peel tests [13]. Belarbi et al developed an original technique expressed as node-failure-based method (NFM) in order to determine the initiation and progressive failure path tested in a matrix-fiber interface using a nonlinear damage evolution law which acts as a viable tool for prediction fracture pattern [14].…”

Section: Introductionmentioning

confidence: 99%

On the modelling of peeling growth using damage models between elasto-viscoplastic film and elastic substrate

Belarbi,

Bouhamida,

Bennegadi

2023

Preprint

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In recent years, there is an increasing trend of use the cohesive zone model (CZM) procedure in peeling test computing the separation energy between the film and the substrate. In this paper, an original technique expressed a failed zone method (FZM) is developed in order to determine in peeling model the progressive failure path in two materials interface. This approach is based on accumulated plastic strain computation leading to a full damage at the root of debonded interface between ductile film and rigid substrate. This damaged zone procedure is numerically conducted by finite element method program based on the release of fully damaged node to separate the connected elements creating a cracking path. In this analysis, a nonlinear damage evolution law is proposed in comparison with Lemaitre and Goijaerts locally accumulated damage models taking into account the materials properties, substrate elastic behaviour and film elasto-viscoplastic constitutive law. In one hand, the proposed damage model is in good agreement with both models and in the other hand this approach reflects perfectly step-by-step the peel growth of ductile film from rigid matrix.

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Section: Introductionmentioning

confidence: 99%

On the modelling of peeling growth using damage models between elasto-viscoplastic film and elastic substrate

Belarbi,

Bouhamida,

Bennegadi

2023

Preprint

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“…Kovalchick and Yang explained that the ERR and peeling rate showed a power-law relationship [22]. Other relevant studies focused on the peeling under rigid substrates, which lay a theoretical foundation for the research of peeling excitation under large deflection and large deformation of flexible substrates [23,24].…”

Section: Introductionmentioning

confidence: 99%

Coupled Excitation Strategy for Crack Initiation at the Adhesive Interface of Large-Sized Ultra-Thin Chips

Chen

Wen

et al. 2023

Processes

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The initial excitation of interface crack of large-size ultra-thin chips is one of the most complicated technical challenges. To address this issue, the reversible fracture characteristics of a silicon-based chip (chip size: 1.025 mm × 0.4 mm × 0.15 mm) adhesive layer interface was examined by scanning electron microscope (SEM) tests, and the characteristics of a cohesive zone model (CZM) unit were obtained through peel testing. The fitting curve of the elastic bilinear model was in high agreement with the experimental data, with a correlation coefficient of 0.98. The maximum energy release rate required for stripping was GC = 10.3567 N/m. Subsequently, a cohesive mechanical model of large-size ultra-thin chip peeling was established, and the mechanical characteristics of crack initial excitation were analyzed. The findings revealed that the larger deflection peeling angle in the peeling process resulted in a smaller peeling force and energy release rate (ERR), which made the initial crack formation difficult. To mitigate this, a coupling control method of structure and force surface was proposed. In this method, through structural coupling, the change in chip deflection was greatly reduced through the surface coupling force, and the peeling angle was greatly improved. It changed the local stiffness of the laminated structure, made the action point of fracture force migrate from the center of the chip to near the edge of the chip, the peeling angle was increased, and the energy release rate was locally improved. Finally, combined with mechanical analysis and numerical simulation of the peeling process, the mechanical characteristics of peeling were analyzed in detail. The results indicated that during the initial crack germination process, the ERR of the peel interface is significantly increased, the maximum stress value borne by the chip is significantly reduced, and the peel safety and reliability are greatly improved.

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“…A vast body of literature has been devoted to the peeling of single-layer adhesives from a stiff substrate, when pulled at a prescribed angle, as evident from ample review studies (Creton and Ciccotti, 2016;Noori et al, 2016;Federle and Labonte, 2019;Skopic and Schniepp, 2020). Often the length of the layer l is assumed to be infinitely long compared to its thickness t, namely l/t → ∞ (Xia et al, 2013;Pesika et al, 2007;Yin et al, 2020;He et al, 2019a;Peng et al, 2019). At this limit, multi-layer systems simplify to a uniform thin film of averaged in-plane stiffness, and the propagation of peeling can arrive at a steady state, thus permitting the use of analytical methods (Garg and Datla, 2019;Xia et al, 2013;Peng and Chen, 2015;Sauer, 2011;Xu et al, 2019;He et al, 2019a).…”

Section: Introductionmentioning

confidence: 99%

Stick-slip phenomena and Schallamach waves captured using reversible cohesive elements

Ringoot,

Roch,

Molinari

et al. 2020

Preprint

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Reversibility is of paramount importance in the correct representation of surface peeling in various physical settings, ranging from motility in nature, to gripping devices in robotic applications, and even to sliding of tectonic plates. Modeling the detachment-reattachment sequence, known as stick-slip, imposes several challenges in a continuum framework. Here we exploit customized reversible cohesive elements in a hybrid finite element model that can handle occurrence of snap-through instabilities. The simulations capture various peeling phenomena that emerge in experimental observations, where layers are pulled from a flat, rigid substrate in the direction parallel to the surface. For long layers, periodicity in reattachment is shown to develop and is linked to the concept of Schallamach waves. Further, the connection between surface properties and stick-slip behavior is investigated: it was found that stickslip is linked to the propensity of the interface to localize deformation and damage. Beyond elucidating the various peeling behaviors and the detachment modes, the theoretical framework developed here provides a straightforward approach for investigation of complex delamination processes, which can guide development of future applications across different scales and in various settings.

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Determination of the interface properties in an elastic film/substrate system

Cited by 25 publications

References 44 publications

On the modelling of peeling growth using damage models between elasto-viscoplastic film and elastic substrate

On the modelling of peeling growth using damage models between elasto-viscoplastic film and elastic substrate

Coupled Excitation Strategy for Crack Initiation at the Adhesive Interface of Large-Sized Ultra-Thin Chips

Stick-slip phenomena and Schallamach waves captured using reversible cohesive elements

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