“…In general, there are type Ι (straddling gap) and type ΙΙ alignments (staggered gap), where the type ΙΙ staggered alignment has been used for photodetector owing to the effective charge distribution that is ascribed to the separation of photogenerated carriers toward opposite direction across the interface. , In the case of the type I alignment, it has the advantage of the multiple quantum well structure enabling the development of high-performance light-emitting diodes exhibiting the high emission efficiency . Based on the XPS analysis results demonstrating the shifts of binding energies in the phase-engineered MoS 2 /SiO 2 heterojunctions, the band bending was revealed at the interface of phase-engineered MoS 2 /SiO 2 heterojunctions owing to the interfacial dipoles, where various factors have shown to contribute to the interfacial dipole such as interfacial defects and interfacial layer, and charge transfer across the interface. , The huge changes in the band alignments at various phase-engineered MoS 2 /SiO 2 heterojunctions were clearly observed, ascribed to the expansion of E g MoS 2 and increased VBM of the MoS 2 monolayer as the phase transition from 1T’- to 2H-phase occurred. This can vary depending on the degree of phase engineering, such as the portion of the 1T’- and 2H-phase content in the hybrid 1T’/2H-phase MoS 2 , where the expansion of E g MoS 2 can increase with increasing the portion of the 2H-phase, as well as changes in the optical and electrical properties such as Raman, UV–vis, and XPS spectra exhibiting more 2H-phase-like features as shown elsewhere. , Considering that the phase-engineered TMDs exhibiting superior electrical, chemical, and catalytic properties can be great promise for a broad range of applications including field-effect transistors, photovoltaics, biomedical devices, and electrocatalytic hydrogen evolution, ,− this modulation of energy band structures and the change in the band alignments at the interfaces with phase-engineered TMDs can provide the evidence for the operation mechanism of various TMD-based electronic devices with the charge transfer phenomena at the interfaces.…”