Determination of residual stress and interface adhesion toughness of thin films by blisters

Yuan, Bo; Harvey, Christopher M.; Critchlow, Gary W.; Thomson, Rachel C.; Wang, Shih-Yu

doi:10.1002/mdp2.60

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…( 2) in Ref. [27], which indicates its applicability to both TCBs and circular blisters. Next, by using Ω given by Eq.…”

Section: Determination Of Swelling-induced Compressive Stress In Gel-...mentioning

confidence: 87%

Swelling-induced telephone cord blisters in hydrogel films

Yuan

Harvey

Shen

et al. 2022

Composite Structures

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“…( 2) in Ref. [27], which indicates its applicability to both TCBs and circular blisters. Next, by using Ω given by Eq.…”

Section: Determination Of Swelling-induced Compressive Stress In Gel-...mentioning

confidence: 87%

Swelling-induced telephone cord blisters in hydrogel films

Yuan

Harvey

Shen

et al. 2022

Composite Structures

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“…A figura 2.3 mostra alguns dos tipos mais comuns de estruturas em filmes sob tensão de compressão. Usualmente, todos esses modos de delaminação, bem como modos de rachadura são caracterizados pelo seguinte parâmetro adimensional: 52,53…”

Section: Falhas De Integridade Em Filmesunclassified

Determinação de propriedades mecânicas de filmes de DLC (Diamond-Like carbon) por meio de estruturas formadas por delaminação espontânea

Álvarez

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Numerous technological applications such as electronics, optics, transportation and other industries, require the synthesis of small parts that can be covered by a film at a given moment of their construction, thus improving the characteristics of these parts for specific applications. In this sense, films are used to optimize one or more properties of the substrate on which it is deposited, or even to provide it with new physical or chemical properties. The delamination of films from their substrate is generally an undesirable phenomenon in different types of applications, for example, a large number of failures in integrated circuits result, in large part, from the mechanical behavior of the film-substrate (delamination, fractures, etc.). However, the mechanical properties of the films are tested by different conventional methods which may not be suitable for films with a thickness of less than 1 µm. As an example, among the different experimental techniques developed to study the mechanical properties of films, as well as to study the fracture characteristics of the film-substrate interface, nanoindentation tests are great for such studies, although these techniques are limited as they cannot exceed 10 − 30% of the film thickness. This work proposes, As an alternative to such limitations, new approaches that use the film's own structural deformations due to delamination to develop techniques that allow characterizing the mechanical properties of the material from which this film is made, as well as the film-substrate interface, which could be very useful in different technological applications related to microelectronics, microfluidics and, in general, NEMS and MEMS devices (Nano and Micro-Electro-Mechanical-Systems). This work initially presents analyzes performed on Straight Sides (SS) deformations. For that, deposition experiments were carried out on lithographed Poly(methyl methacrylate) (PMMA), creating areas whose lengths are much greater than their width, showing necessary experimental conditions to obtain well-formed SS-type structures which were studied through different models. Soon, theoretical models for more complex structures called Telephone Cord (TC) are presented, thus, with the study of experimental data through these models, mechanical properties of DLC films were obtained, as done for SS structures.

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Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems

Truong

Nguyen

Zhao

et al. 2021

Small

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Transformation of conventional 2D platforms into unusual 3D configurations provides exciting opportunities for sensors, electronics, optical devices, and biological systems. Engineering material properties or controlling and modulating stresses in thin films to pop‐up 3D structures out of standard planar surfaces has been a highly active research topic over the last decade. Implementation of 3D micro and nanoarchitectures enables unprecedented functionalities including multiplexed, monolithic mechanical sensors, vertical integration of electronics components, and recording of neuron activities in 3D organoids. This paper provides an overview on stress engineering approaches to developing 3D functional microsystems. The paper systematically presents the origin of stresses generated in thin films and methods to transform a 2D design into an out‐of‐plane configuration. Different types of 3D micro and nanostructures, along with their applications in several areas are discussed. The paper concludes with current technical challenges and potential approaches and applications of this fast‐growing research direction.

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Determination of residual stress and interface adhesion toughness of thin films by blisters

Cited by 3 publications

References 10 publications

Swelling-induced telephone cord blisters in hydrogel films

Swelling-induced telephone cord blisters in hydrogel films

Determinação de propriedades mecânicas de filmes de DLC (Diamond-Like carbon) por meio de estruturas formadas por delaminação espontânea

Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems

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