Determination of Photoresist Degradation Products in O<sub>3</sub>/DI Processing

Vankerckhoven, H.; Smedt, Florimond De; Herp, B. Van; Claes, M.; Gendt, Stefan De; Heyns, Marc; Vinckier, Chris

doi:10.1080/01919510208901629

Cited by 10 publications

(10 citation statements)

References 16 publications

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“…On the other hand, ozone is applied to environmentally friendly cleaning techniques for water and semiconductor manufacturing [5][6][7][8][9][10][11][12]. Ozone water degrades compounds with C=C bond or benzene ring to carboxylic acid [13,14].…”

Section: Introductionmentioning

confidence: 99%

Effect of Temperature on Degradation of Polymers for Photoresist Using Ozone Microbubbles

Matsuura

Nishiyama

Sato

et al. 2016

J. Photopol. Sci. Technol.

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We studied about an effect of temperature on degradation of polymers for photoresist using ozone microbubbles as an environmentally friendly cleaning technique. The dissolved ozone concentration of ozone microbubbles was decreased with the increasing temperature because the solubility of ozone gas was decreased and self-decomposition of ozone in water was promoted. While, the reactivity between ozone and novolak resin was increased with the increasing temperature. Consequently, novolak resin was most efficiently removed at around 23 C. The activated energy for removal of novolak resin using ozone microbubbles was 23 kJ/mol determined from Arrhenius plots. Polyvinyl phenol was removed by ozone microbubbles, and its removal rate was comparable with that of novolak resin. Polymethyl methacrylate without C=C bond or benzene ring structure could not be removed by ozone microbubbles.

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Section: Introductionmentioning

confidence: 99%

Effect of Temperature on Degradation of Polymers for Photoresist Using Ozone Microbubbles

Matsuura

Nishiyama

Sato

et al. 2016

J. Photopol. Sci. Technol.

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“…DIO 3 concentration was automatically controlled by an ozone generation system (AX8403, MKS, USA) with dissolved and gas ozone sensors (d-FOZZ and g-FOZZ, IN USA Inc., USA) as shown Fig 1. It also could raise the DIO 3 concentration by controlling the O 3 gas pressure in an ozone contactor according to Henry's law (7)(8)(9). gas liq P k S • = [1] S liq is the solubility of a solute gas in the liquid, P gas is the pressure of solute gas in liquid and k is Henry's constant.…”

Section: Methodsmentioning

confidence: 99%

Removal of Organic Wax and Particles on Silicon after Batch type Polishing by Ozonated DI Water

Lee

Kim

et al. 2007

ECS Trans.

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To manufacture the wafer used for device chip, several polishing and cleaning process are required. In this study, new concept cleaning process was developed with ozonated DI water (DIO 3 ) to achieve low COO (cost of ownership). Ozone concentration of 55 ppm is used to remove the wax film and particles. A commercial dewaxer was combined with DIO 3 to reduce dewaxing time and SC-1 steps. DIO 3 rinse resulted in less than 50Å of wax thickness while DI water rinse did thicker than 300 Å. Replacing DI rinse with DIO 3 rinse resulted in lower contact angle and completely hydrophilic surface. Optical images of surfaces treated with DIO 3 showed thinner wax layer which indicates no further cleaning steps required. Particle removal efficiency improved further by combining SC-1 cleaning step with DIO 3 rinsing process.

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“…As the internal gas of microbubbles, O 3 is often used. O 3 has a strong oxidation power and is applied to waste water treatment and semiconductor manufacturing [5][6][7][8][9][10][11]. O 3 water degrades compounds with C=C bond to carboxylic acid [12,13].…”

Section: Introductionmentioning

confidence: 99%

Degradation of Poly(acrylic acid) in Aqueous Solution by Using O<sub>3</sub> Microbubble

Miyazaki

Nishiyama

Sato

et al. 2018

J. Photopol. Sci. Technol.

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Polyacrylic acid (PAA) aqueous solution was treated with O 3 microbubbles and O 3 water, there was no difference in decrease in molecular weight of PAA due to the presence or absence of microbubbles. Regardless of dissolved O 3 concentration, O 3 microbubbles alone did not cause reduction in total organic carbon (TOC) and mineralization did not proceed. In the advanced oxidation prosess with hydrogen peroxide added, the molecular weight and TOC decreased. It is considered that active oxygen is generated from hydrogen peroxide by advanced oxidation and PAA is decomposed. From these results, it is no considered generation of reactive oxygen species by microbubbles in the decomposition of PAA.

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Determination of Photoresist Degradation Products in O₃/DI Processing

Cited by 10 publications

References 16 publications

Effect of Temperature on Degradation of Polymers for Photoresist Using Ozone Microbubbles

Effect of Temperature on Degradation of Polymers for Photoresist Using Ozone Microbubbles

Removal of Organic Wax and Particles on Silicon after Batch type Polishing by Ozonated DI Water

Degradation of Poly(acrylic acid) in Aqueous Solution by Using O<sub>3</sub> Microbubble

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Determination of Photoresist Degradation Products in O3/DI Processing

Cited by 10 publications

References 16 publications

Effect of Temperature on Degradation of Polymers for Photoresist Using Ozone Microbubbles

Effect of Temperature on Degradation of Polymers for Photoresist Using Ozone Microbubbles

Removal of Organic Wax and Particles on Silicon after Batch type Polishing by Ozonated DI Water

Degradation of Poly(acrylic acid) in Aqueous Solution by Using O<sub>3</sub> Microbubble

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Product

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Determination of Photoresist Degradation Products in O₃/DI Processing