2017
DOI: 10.1007/s10854-017-7912-4
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Determination of lapping parameters for silicon wafer using an artificial neural network

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Cited by 16 publications
(4 citation statements)
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“…In the past few decades, many artificial intelligence technologies [17,18,19] have been applied to describe this nonlinear relationship, such as genetic algorithm, neurocomputing, fuzzy logic, and artificial neural network (ANN). Compared with other methods, artificial neural network (ANN) [20,21] is a promising technology in the performance prediction field because it can solve problems faster. ANN models [16,22,23,24,25] are well known for function approximation and feature extraction of highly complex nonlinear relationships without any physical background knowledge.…”
Section: Introductionmentioning
confidence: 99%
“…In the past few decades, many artificial intelligence technologies [17,18,19] have been applied to describe this nonlinear relationship, such as genetic algorithm, neurocomputing, fuzzy logic, and artificial neural network (ANN). Compared with other methods, artificial neural network (ANN) [20,21] is a promising technology in the performance prediction field because it can solve problems faster. ANN models [16,22,23,24,25] are well known for function approximation and feature extraction of highly complex nonlinear relationships without any physical background knowledge.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, they derived many different parameters for varying operation conditions to minimise material consumption and surface roughness using ANNs algorithm [19]. Furthermore, the lapping parameters of silicon wafers were studied to optimise the lapping duration and minimise lapping materials consumed during lapping process [20]. Moreover, the BA-based ANN also was used to estimate Seebeck coefficient and other parameters of the thermoelectric materials [12].…”
Section: Introductionmentioning
confidence: 99%
“…The roughness is often extracted from the surface morphology. More and more measuring instruments are used to get the surface morphology, such as the contact surface profiler [2], laser interferometric profiler [3], and noncontact digital optical profiler [4]. The contact surface profiler is the most commonly used instrument.…”
Section: Introductionmentioning
confidence: 99%
“…It is used to measure the surface profile. Because it is connected with the computer, the surface profile information can display on the computer [2]. When the surface morphology is obtained, the method of extracting the roughness needs to be considered.…”
Section: Introductionmentioning
confidence: 99%