Determination of Adhesion Energy of CN_xThin Film on Silicon from Micro-Scratch Testing

The Effect of Aging on the Delamination Fracture Energy of Glass Solar Reflectors

“…There are many testing methods available to measure the DFE of a multi-layered structure: the delamination test which is one of the most frequently used test methods for assessing the failure of flexible laminates, such as those employed in the packaging and electronic industries (Mittal, 1976;Kinloch et al, 1994;Moore and Williams, 2000;Oreski and Wallner, 2005;Jesdinszki et al, 2012;Kucukpinar et al, 2014;Jang et al, 2017); the micro-scratch test which is widely used to assess the adherence of thin film to substrate since it is relatively simple to use and provides simple and rapid qualitative (and semi-quantitative) information (Laugier, 1984;Liu et al, 2004;Rats et al, 1999;Venkataraman et al, 1993); the blister test which relates the pressure at which debond initiates to the work of adhesion of the film (Dannenberg, 1961;Gent and Lewandowski, 1987;Hinkley, 1983;Mittal and Kern, 1987;Allen and Senturia, 1988); the residual-stress driven delamination or micro-strip test developed by Bagchi et al (1994); the indent test measuring the delamination of ductile coatings on brittle substrates by using a micro-indenter to deform the coating (Evans and Hutchinson, 1984;Rossington et al, 1984;Allen and Senturia, 1988;Drory et al, 1994;Drory and Hutchinson, 1996); the edge peel test during which the fracture process is largely elastic (Drory et al, 1988;Shaffer et al, 1993;Bagchi et al, 1994;Shaffer et al, 1994;McGarry and Shaffer, 1994;Shaffer et al, 1996Shaffer et al, , 1998; the method based on buckling (Bordet et al, 1998;Hutchinson and Suo, 1991) or crack formation …”

Black anodic coatings for space applications: Study of the process parameters, characteristics and mechanical properties

“…The scratch test is particularly suited for hard coatings on soft substrates (Darque-Ceretti and Felder, 2003;Bull and Berasetegui, 2006) and is used for instance to study the adhesion of various coatings including TiN (Holmberg et al, 2003) or CN (Liu et al, 2004). Increasing the normal load of the stylus, a critical load can be measured when failure of the coating occurs.…”