2016
DOI: 10.1016/j.microc.2016.03.015
|View full text |Cite
|
Sign up to set email alerts
|

Determination of a typical additive in zinc electroplating baths

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
3
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 8 publications
(4 citation statements)
references
References 15 publications
0
3
0
Order By: Relevance
“…These additives alter the plating procedure to produce electrodeposits with the required qualities for the applications they are intended for. It is challenging to maintain control of the plating process since these additives gradually degrade during plating and the electrodeposition process is sensitive to the additive concentration [10].…”
Section: Zinc Electroplatingmentioning
confidence: 99%
“…These additives alter the plating procedure to produce electrodeposits with the required qualities for the applications they are intended for. It is challenging to maintain control of the plating process since these additives gradually degrade during plating and the electrodeposition process is sensitive to the additive concentration [10].…”
Section: Zinc Electroplatingmentioning
confidence: 99%
“…27,37 Additives, such as bis(3-sulfopropyl) disulfide (SPS) that acts a brightner, 38−40 and sodium gluconate, 41,42 are typically used in copper and nickel plating baths, respectively, and an extensive library of additives have been investigated for other metal depositions. 36,43,44 Surfactants, such as cetyltrimethylammonium bromide (CTAB), have also been used in deposition baths due to their potential to affect the surface tension between the electrolyte and the electrode and can have effects on coating adhesiveness and morphology at varying concentrations. 45,46 Depending on the interactions of CTAB with the substrate or the active metal being deposited, it may act as a leveling or brightening agent.…”
Section: ■ Introductionmentioning
confidence: 99%
“…A brightener can inhibit the rate of the electrodeposition by interacting with the electrode surface and preventing the deposition of the active ion in that area . As a result, brighteners can also help level the micro profile of the electrode surface without the need for polishing after the deposition. , Additives, such as bis­(3-sulfopropyl) disulfide (SPS) that acts a brightner, and sodium gluconate, , are typically used in copper and nickel plating baths, respectively, and an extensive library of additives have been investigated for other metal depositions. ,, Surfactants, such as cetyltrimethylammonium bromide (CTAB), have also been used in deposition baths due to their potential to affect the surface tension between the electrolyte and the electrode and can have effects on coating adhesiveness and morphology at varying concentrations. , Depending on the interactions of CTAB with the substrate or the active metal being deposited, it may act as a leveling or brightening agent. Additonally, CTAB can interact directly with the deposited metal instead of the substrate and has been used to cap the growth of particles as demonstrated in nanoparticle synthesis and also has the potential to act as a corrosion inhibitor . Despite the tunability that can be acheived through these organic additives, there are few publications reporting the tunability of electrodeposited Sb anodes for battery applications using solution additives. , …”
Section: Introductionmentioning
confidence: 99%
“…The common anti-corrosion measures for magnesium alloys include electroplating, surface coating, plasma spraying, chemical oxidation, and anodizing [1][2][3]. Among them, the anodizing treatment has a satisfactory anti-corrosion effect, but the treatment process is complicated.…”
Section: Introductionmentioning
confidence: 99%