Deterioration of microwave dielectric properties of low-loss thermosetting polyphenylene oxide/hydrocarbon resin induced by short-term thermo-oxidative aging

Fang, Zeming; Yu, Xueyi; Qin, Yijing; Li, Dan; Liu, Qianfa; Wang, Ke

doi:10.1016/j.polymdegradstab.2022.110193

Cited by 10 publications

(7 citation statements)

References 49 publications

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“…The coupling effect of thermal oxidative aging and moisture absorption may further impact the dielectric properties of the materials. 51 Consequently, we tested the change in D f of samples that had been aged for 7 days after exposure to humidity. As shown in Figure 11b, the change in D f (ΔD f ) before and after moisture absorption is more significant in aged samples compared to unaged samples, largely because the aged samples have an increased concentration of polar groups, which heightens their hydrophilicity.…”

Section: Resultsmentioning

confidence: 99%

Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss

Fang,

Zhu,

et al. 2024

Ind. Eng. Chem. Res.

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Ultralow-loss thermosetting resins cured via free-radical polymerization have been extensively applied as the polymeric matrix in high-frequency and high-speed printed circuit boards and electronic packaging substrates. In recent years, silicon doping has been commonly acknowledged for its potential to reduce the dielectric loss of materials. Three silicon-containing cross-linkers are investigated in this work for use in ultralow-loss thermosetting poly(phenylene oxide) (PPO) materials. The study compares the influence of these silicon-containing cross-linkers with two commercially available cross-linkers, focusing on their effects on curing temperature, dielectric properties, thermal characteristics, moisture resistance, and aging resistance. Silicon-containing cross-linkers showed appropriate reaction temperatures that were comparable to that of conventional epoxy materials. More importantly, they decreased the dielectric loss of cured samples with the lowest dissipation factor (D f ) value of 0.00159 at 10 GHz. The addition of silicon atoms also slowed the deterioration of dielectric properties during high-temperature aging experiments and reduced moisture absorption in PPO samples. However, there are also concerns regarding the reduction in the glass-transition temperature and the increase in the coefficient of thermal expansion. These results demonstrate the promising potential of silicon-containing cross-linkers in enhancing the performance of ultralow-loss PPO materials for advanced electronic packaging applications.

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Section: Resultsmentioning

confidence: 99%

Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss

Fang,

Zhu,

et al. 2024

Ind. Eng. Chem. Res.

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“…For PPO/TAIC system, three types of functional group of -OH, -C=C-, -C=O would contribute to polarizability in different ways [98,99]. Fang et al found that thermo-oxidative aging of a PPO/hydrocarbon resin system with TAIC as crosslinking agent occurs easily at high temperature, and the rapid increased D f from 0.0016 to 0.0066 can be measured at 150 • C only for 48 h, owing to the generation of polar oxidation products [100]. Compared to the negligible oxidation of TAIC and PPO, the oxidation of hydrocarbon resin (Ricon 100) plays a dominant role at the early stage of aging.…”

Section: Ppo-based Thermoset Resin Systemsmentioning

confidence: 99%

Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates

Qin¹,

Yu²,

Fang³

et al. 2023

J. Phys. D: Appl. Phys.

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With the rapid development of electronic information technology in the 5G era towards high integration, short propagation delay, and elevated assembly temperatures, more academic and industrial attention has been focused on high-frequency and high-speed copper-clad laminates (CCLs). Compared with conventional polymeric matrices, thermoset polyphenylene oxide (PPO) has become one of the most attractive resins applied in high-performance CCLs (HPCCLs) because of its excellent comprehensive properties, including outstanding dielectric properties, high thermal stability, great processibility, and low moisture absorption, etc. This review focuses on the history of the development of PPO prepolymers/oligomers, PPO-based thermoset resin systems, and PPO/inorganic filler composites to optimize the dielectric constant, dielectric loss, thermal conductivity, coefficient of thermal expansion, and mechanical properties. Moreover, some current challenges of PPO-based thermoset systems have been identified, such as developing feasible solutions to ensure the anti-aging properties for long-term reliability under harsh environments of high temperature, high humidity, and even high-frequency electromagnetic radiation. In general, more in-depth investigations of PPO-based thermoset systems for HPCCLs are required in the future.

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“…For CPIs, crosslinking between TAIC and DDA creates a dense hydrophobic structure and further decreases the water uptake capacity. 61 Higher crosslink density results in tightly linked polymer chains, forming intensive hydrophobic networks. 27 This strong hydrophobic characteristic of the CPIs is beneficial for the longterm stability in humid environments.…”

Section: Water Absorption Behaviorsmentioning

confidence: 99%

Monomer ratio‐controlled polyimides with enhanced dielectric properties and thermal stabilities through crosslinking network

Huang,

Lin,

Lee

et al. 2023

Journal of Polymer Science

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Polyimides (PI) are considered as one of the most used materials for flexible printed circuit board substrates because of their excellent thermal stabilities, outstanding mechanical properties, and great dielectric properties. Dielectric constants (Dk) of common commercial PIs, however, are still above 3.0 (at 10 GHz), which is still substandard for high‐frequency applications. In this study, we develop thermally stable PIs with enhanced dielectric properties by structural design and crosslinking. Stiff aromatic 2,2′‐bis(trifluoromethyl)benzidine (TFMB) and soft aliphatic dimer diamines (DDA, priamine), including priamine 1074 (DDA‐1) and priamine 1071 (DDA‐2), are used as the diamines, and cyclobutanetetracarboxylic dianhydride (CBDA) is used as the dianhydride. By adjusting the ratio of the diamines, a series of PIs (PI‐1–PI‐5) with high thermal stabilities and low‐Dk values are synthesized. Among these PIs, PI‐4 synthesized by diamines with the ratio of TFMB:DDA‐1:DDA‐2 = 85:10:5, possesses relatively good performances. Therefore, PI‐4 is further chosen to be thermally crosslinked. By changing the contents of the crosslinker, triallyl isocyanurate (TAIC), crosslinked PIs (CPIs) are synthesized. The resulting CPIs have a significant improvement in thermal properties, dielectric properties, and mechanical strengths. Especially, for the CPI‐4‐30, in which 30% of TAIC is used, the glass transition temperature (Tg) increases by 20°C, the Dk decreases from 2.62 to 2.41, and the ultimate tensile strength boosts from 91.65 to 115.16 MPa. The CPIs with low Dk and high Tg values may have great potential as substrate materials for broad applications, such as microelectronics and integrated circuit packages.

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Deterioration of microwave dielectric properties of low-loss thermosetting polyphenylene oxide/hydrocarbon resin induced by short-term thermo-oxidative aging

Cited by 10 publications

References 49 publications

Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss

Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss

Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates

Monomer ratio‐controlled polyimides with enhanced dielectric properties and thermal stabilities through crosslinking network

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