Abstract:We utilize a frequency-modulated charge pumping methodology to measure quickly and conveniently single “charge per cycle” in highly scaled Si/SiO2 metal–oxide–semiconductor field effect transistors. This is indicative of detection and manipulation of a single interface trap spin species located at the boundary between the SiO2 gate dielectric and Si substrate (almost certainly a Pb type center). This demonstration in sub-micrometer devices in which Dennard scaling of the gate oxide has yielded extremely large … Show more
This work explores the atomic-scale nature of defects within hafnium dioxide/silicon dioxide/silicon (HfO2/SiO2/Si) transistors generated by hot-carrier stressing. The defects are studied via electrically detected magnetic resonance (EDMR) through both spin-dependent charge pumping and spin-dependent tunneling. When combined, these techniques probe defects both at the Si-side interface and within the oxide-based gate stack. The defects at the Si-side interface are found to strongly resemble Pb-like defects common in the Si/SiO2 system. The defect within the gate stack has not been positively identified in the literature thus far; this work argues that it is a Si-dangling bond coupled to one or more hafnium atoms. The use of EDMR techniques indicates that the defects detected here are relevant to electronic transport and, thus, device reliability. This work also highlights the impressive analytical power of combined EDMR techniques when studying complex, modern materials systems.
This work explores the atomic-scale nature of defects within hafnium dioxide/silicon dioxide/silicon (HfO2/SiO2/Si) transistors generated by hot-carrier stressing. The defects are studied via electrically detected magnetic resonance (EDMR) through both spin-dependent charge pumping and spin-dependent tunneling. When combined, these techniques probe defects both at the Si-side interface and within the oxide-based gate stack. The defects at the Si-side interface are found to strongly resemble Pb-like defects common in the Si/SiO2 system. The defect within the gate stack has not been positively identified in the literature thus far; this work argues that it is a Si-dangling bond coupled to one or more hafnium atoms. The use of EDMR techniques indicates that the defects detected here are relevant to electronic transport and, thus, device reliability. This work also highlights the impressive analytical power of combined EDMR techniques when studying complex, modern materials systems.
This paper reviews the evolution of the charge pumping (CP) technique and its applications from the micrometer-scale to the atomic-scale device era. We describe the more significant milestones of the CP technique (CPT) over the past couple of decades, giving insight into its potentialities. We start with the most popular one “traditional or conventional CP” and follow up with its different extensions in various fields like transistor reliability and radiation damage characterizations in devices fabricated with old and new semiconductor and dielectric materials. We show its easy adaptability for transistors with specific geometries. Advantages, weaknesses, as well as future tendencies of CPT and its variants, are also discussed.
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