Detection of cracks in multilayer ceramic capacitors by X-ray imaging

Andersson, Caroline; Ingman, Jonny; Varescon, Elise; Kiviniemi, Mika

doi:10.1016/j.microrel.2016.07.110

Cited by 24 publications

(10 citation statements)

References 2 publications

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“…Also, a 48 Ω resistor was mounted onto the PCBA to limit the current during turn-on and another 1 Ω measurement resistor. The MLCCs were mounted in a 45 • orientation to the edges of the board and the resulting bending direction due to the experimental results supporting that this orientation allows the lowest bending strain levels to introduce flex cracks [13].…”

Section: The Experimentsmentioning

confidence: 91%

“…The strain level was calculated using the board thickness of 1.5 mm, the distances between the anvils and the displacement through bending according to IPC/JEDEC-9702A standard [16], as also described in [13].…”

Section: B Insertion Of Flex Cracks Through Mechanical Bendingmentioning

confidence: 99%

“…After the bending experiments where the flex cracks were introduced in a reproducible way, the MLCCs were examined in a Phoenix Nanomex X-ray machine that has a resolution of 200 nm [17] in order to find flex cracks [13]. The settings of 160 kV and 120 µA were used for 2D imaging at a viewing angle of 70 • together with the software x|act.…”

Section: X-ray Imaging and Cross-section Analysismentioning

confidence: 99%

“…Upon initial LIT measurements of all of the 24 MLCCs, the four PCBAs were bent to 6000 µStr in order to introduce flex cracks [13]. X-ray imaging was done to confirm the presence of cracks in all of the MLCCs and one example can be seen in Fig.…”

Section: A After Introduction Flex Cracksmentioning

confidence: 99%

See 3 more Smart Citations

Lock-in Thermography Failure Detection on Multilayer Ceramic Capacitors After Flex Cracking and Temperature–Humidity–Bias Stress

Andersson

Kristensen

Miller

et al. 2018

IEEE J. Emerg. Sel. Topics Power Electron.

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A non-destructive method using lock-in thermography to detect failures in multilayer ceramic capacitors is presented. The thermal response of new 25 V multilayer ceramic capacitors is compared to the thermal response of the same capacitors after insertion of flex cracks as well as after 24 and 96 hours of total exposure time to a temperature of 75 • C, 75% relative humidity, and 25 V bias. The thermal response was measured before the introduction of any flex cracks, as well as directly after flex cracks were inserted by bending the printed circuit board to 6000 µStr. No significant change was detected in the thermal profile upon introduction of flex cracks of which the presence was verified by X-ray imaging. After the multilayer ceramic capacitors were subjected to a total of 96 hours of temperaturehumidity-bias stress, a significant increase in leakage current could be detected as a hotspot in one of the initially 24 samples by lock-in thermography. The influence of the different parameters, such as lock-in frequency, bias voltage and measurement time, on the detectability of the hotspot is presented.

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Section: The Experimentsmentioning

confidence: 91%

Section: B Insertion Of Flex Cracks Through Mechanical Bendingmentioning

confidence: 99%

Section: X-ray Imaging and Cross-section Analysismentioning

confidence: 99%

Section: A After Introduction Flex Cracksmentioning

confidence: 99%

See 2 more Smart Citations

Lock-in Thermography Failure Detection on Multilayer Ceramic Capacitors After Flex Cracking and Temperature–Humidity–Bias Stress

Andersson

Kristensen

Miller

et al. 2018

IEEE J. Emerg. Sel. Topics Power Electron.

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show abstract

“…3(b) lists some commonly used parameter acquisition methods. It is found that industrial instruments including weighting meters [108], [109], X-ray image meters [110], optical inspection meter [111], acoustic detection meter [112], thermography meter [113], etc., are widely used to obtain non-electrical parameters. Moreover, internal temperature sensors [114] and internal pressure sensors [115] are employed to obtain the internal temperature and pressure of capacitors.…”

Section: B Design Procedures For Condition Monitoringmentioning

confidence: 99%

An Overview of Condition Monitoring Techniques for Capacitors in DC-Link Applications

Zhao

Davari

et al. 2021

IEEE Trans. Power Electron.

140

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Capacitors are widely used in dc links of power electronic converters to balance power, suppress voltage ripple, and store short-term energy. Condition monitoring (CM) of dc-link capacitors has great significance in enhancing the reliability of power converter systems. Over the past few years, many efforts have been made to realize CM of dc-link capacitors. This paper gives an overview and a comprehensive comparative evaluation of them with emphasis on the application objectives, implementation methods, and monitoring accuracy when being used. First, the design procedure for the condition monitoring of capacitors is introduced. Second, the main capacitor parameters estimation principles are summarized. According to these principles, various possible CM methods are derived in a step-by-step manner. On this basis, a comprehensive review and comparison of CM schemes for different types of dc-link applications are provided. Finally, application recommendations and future research trends are presented.

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The Influence of Edge Boundary Conditions and Cracks on Vibrational Modes of Multilayer Ceramic Capacitors

Ortiz¹,

Davis²,

Troyer³

et al. 2018

Topics in Modal Analysis &Amp; Testing, Volume 9

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Detection of cracks in multilayer ceramic capacitors by X-ray imaging

Cited by 24 publications

References 2 publications

Lock-in Thermography Failure Detection on Multilayer Ceramic Capacitors After Flex Cracking and Temperature–Humidity–Bias Stress

Lock-in Thermography Failure Detection on Multilayer Ceramic Capacitors After Flex Cracking and Temperature–Humidity–Bias Stress

An Overview of Condition Monitoring Techniques for Capacitors in DC-Link Applications

The Influence of Edge Boundary Conditions and Cracks on Vibrational Modes of Multilayer Ceramic Capacitors

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