1980
DOI: 10.1109/t-ed.1980.20023
|View full text |Cite
|
Sign up to set email alerts
|

Designing the power-handling capabilities of MOS power devices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
1
0

Year Published

1988
1988
1988
1988

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 6 publications
0
1
0
Order By: Relevance
“…Semi-insulating polycrystalline silicon films deposited pyrolytically by chemical vapor deposition at low pressure (LPCVD) are steadily finding a wider acceptance as an advantageous passivation for silicon high-voltage devices. The main effort of the investigations has been put on the bulk electrical properties of SIPOS films (1)(2)(3)(4)(5). Only a few data are available concerning the interface trap density in the upper half (energy E of the traps higher than E~ + 0.1 eV, Ei = intrinsic Fermi level) and the lower half of the bandgap (E lower than Ei -0.15 eV) (6,7).…”
mentioning
confidence: 99%
“…Semi-insulating polycrystalline silicon films deposited pyrolytically by chemical vapor deposition at low pressure (LPCVD) are steadily finding a wider acceptance as an advantageous passivation for silicon high-voltage devices. The main effort of the investigations has been put on the bulk electrical properties of SIPOS films (1)(2)(3)(4)(5). Only a few data are available concerning the interface trap density in the upper half (energy E of the traps higher than E~ + 0.1 eV, Ei = intrinsic Fermi level) and the lower half of the bandgap (E lower than Ei -0.15 eV) (6,7).…”
mentioning
confidence: 99%