Designing of high-performance epoxy adhesive with recycled polymers and silica nano particles (SNPs) in epoxy/carbon fiber composite-steel bonded joints: Mechanical properties, thermal stability and toughening mechanisms

Abbasi, Zohreh; Jazani, Omid Moini; Sohrabian, Majid

doi:10.1016/j.jtice.2021.05.016

Cited by 25 publications

(50 citation statements)

References 53 publications

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“…Indeed, it could be stipulated that the increase in the hydroxyl groups of the phenolic resin set the scene for proper interaction with the substrate, enhancing the adhesion of the adhesive to the aluminum substrate through strong surface bonds and hence improved shear strength. [ 30 ] It can be said that due to the increase of hydroxyl groups in phenolic, it causes a proper interaction with the aluminum substrate and causes a strong bond with the surface and thus increases the lap shear strength. It can also be said that phenolic hydroxyl groups react with the epoxy ring, which increases the ring opening (oxirane) and degree of crosslinking, thereby increasing the shear strength of the adhesive to the substrate.…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

“…When the dosage of alumina NPs further increased to 5 phr, the NP agglomeration and increased viscosity of the system resulted in reduced wetting capacity of the adhesive and hence its shear strength, which decreased to 4.08 MPa. [30] Based on the achieved results, the ternary epoxy sample containing BCP and alumina NPs exhibited 112% increase in shear strength compared to pure epoxy. We believe that this increase roots in the catalyzing effect of the alumina NPs due to the presence of hydroxyl groups and BCP that can form hydrogen bonds to the oxirene ring of epoxy and hence trigger ring opening which leads to increased cross-linking and formation of a 3D lattice.…”

Section: Single-lap Strength Testsmentioning

confidence: 91%

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Design and characterization of high‐performance epoxy adhesive with block copolymer and alumina nanoparticles in aluminum‐aluminum bonded joints: Mechanical properties, lap shear strength, and thermal stability

2022

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In this research, phenolic resin and poly (butyl‐acrylate‐block‐styrene) copolymer were used in the formulation of epoxy adhesive to improve its thermal stability and toughness. Also, in order to improve the mechanical properties such as the modulus and tensile strength, aluminum oxide nanoparticles (NPs) were added to the epoxy based resin. Effects of different factors such as percent contents of phenolic resin, toughening agent, and aluminum oxide NPs on the microstructure, mechanical properties, and thermal stability of the epoxy‐based adhesives were investigated. Thermogravimetric analysis, Fourier transform infrared spectroscopy, and field‐emission scanning electron microscopy were used to investigate the thermal, mechanical, and morphological properties of the prepared epoxy adhesive samples. In addition, the curing kinetics of the optimal specimens was studied based on differential scanning calorimetry (DSC). The experimental results indicated that the phenolic decreased strength of dog‐bone samples, while increased the adhesion strength in metal‐to‐metal single‐lap strength. On the other hand, addition of block‐copolymers as toughening agent led to a consistent decrease in the modulus as well as increasing the tensile strength. Also, results of single‐lap strength tests showed that, in the optimal quad system, the four components exhibit synergetic effects and show a single‐lap strength that is 152% higher than that of pure epoxy. The DSC analysis indicated that the presence of alumina NPs and block‐copolymers tend to reduce the initial curing temperature while increasing the curing reaction heat.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Single-lap Strength Testsmentioning

confidence: 91%

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Design and characterization of high‐performance epoxy adhesive with block copolymer and alumina nanoparticles in aluminum‐aluminum bonded joints: Mechanical properties, lap shear strength, and thermal stability

2022

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“…Among these metals, cerium can be introduced as a suitable candidate due to its non-toxic, environmentally friendly properties and its simplicity of reaching and decreasing the rate of cathodic delamination . Also, it has attracted significant attention due to its special chemical and physical characteristics, including stability and appropriate corrosion resistance of coating in aerospace applications, electrochemical cells, photocatalysis, and sensors . Despite the many advantages of cerium conversion coating, one of the main drawbacks which hamper its use is the appearance of pores and micro-cracks after drying.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Self-Healing and Adhesion Bonding Properties: Investigating the Promising Potential of Ce-ZIF8 MOF Hybrid Thin Films as pH-Responsive Nanocoatings

Falahaty marvast,

Gholambargani,

Ramezanzadeh

et al. 2023

Langmuir

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Further modification of the pre-treated steel surface with cerium conversion coating was performed using a novel porous coordination polymer (PCP) based on zeolitic imidazole framework-8 (ZIF8) in order to reduce the defect and disorders of the surface. The treated mild steels (MS) with Ce (MS/Ce) and Ce-ZIF8 (MS/Ce-ZIF8) were characterized by the GIXRD, Raman, and FT-IR, and via contact angle and FE-SEM, their surface features were investigated. The protection performance of the samples against corrosion was evaluated in the saline solution media using electrochemical impedance spectroscopy (EIS, in the long term) and polarization tests. The results evidenced that applying the ZIF8 nanoparticles onto the Ce-treated steel surface increased the total resistance value after 24 h of immersion (49.47%). Afterward, the ZIF8-modified coating (MS/Ce and MS/Ce-ZIF8) impact on the epoxy coating protection function was characterized by EIS (in the scratched form), salt spray (5 wt % salts), cathodic disbonding (at 25 °C), and pull-off tests. The EIS outcomes of the scratched coatings proved approximately a 51.29% increase in R t of the MS/Ce-ZIF8/EC sample compared with the MS/EC sample after 24 h of immersion. The cathodic disbonding test results after 24 h of exposure revealed that the delamination area of the coating decreased in the modified sample, and the delamination radius of the epoxy coating was about 4.78, 2.96, and 2.0 mm for the MS/EC, MS/Ce/EC, and MS/Ce-ZIF8/EC samples, respectively.

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“…Hybrid epoxy composites are used in a variety of industrial applications, including automobiles, ships, aircraft, and electrical systems; The idea of optoelectronic and electronic devices protects electrical components from short circuits, dust, and moisture [1,2]. Epoxy is one of the most common thermosetting polymer matrixes because of its exceptional chemical resistance, and its qualities may be increased by reinforcing with fibres and particles [3].…”

Section: Introductionmentioning

confidence: 99%

Physical Properties of Hybrid Epoxy Composites Reinforced with Carbon Fiber and Ceramic Particles

Ali

Shihab

Mohamed

2022

DJES

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Hybrid polymer compounds have become modern times, as their applications have increased, especially those reinforced with fibers and molecules due to their high performance, which allows them to be used in different applications. In this research, the dependence of the thermal conductivity and density of epoxy compounds on the volume fraction ratio of the reinforcements including carbon fibers, silicon carbide and alumina will be discussed. new hybrid epoxy compounds have been developed. The epoxy compounds reinforced with plain weave carbon fibers with different volume fractions of micro-particles of silicon carbide and alumina were prepared by hand lay-up. The physical properties including thermal conductivity and density of hybrid epoxy compounds were determined experimentally. The results showed an increase in the thermal conductivity by increasing the proportion of silicon carbide and alumina without affecting the density of the epoxy compound. This high improvement in thermal conductivity with low density in these hybrid epoxy composites have been driven them as possible nominations for electronic devices. The optimum content of hybrid epoxy composite for electronic applications is at SiC 10% and Al2O3 5% with 15 carbon fiber and 70 epoxy. Thus, a new polymer-based compound with improved thermal conductivity for electronic applications was produced.

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Designing of high-performance epoxy adhesive with recycled polymers and silica nano particles (SNPs) in epoxy/carbon fiber composite-steel bonded joints: Mechanical properties, thermal stability and toughening mechanisms

Cited by 25 publications

References 53 publications

Design and characterization of high‐performance epoxy adhesive with block copolymer and alumina nanoparticles in aluminum‐aluminum bonded joints: Mechanical properties, lap shear strength, and thermal stability

Design and characterization of high‐performance epoxy adhesive with block copolymer and alumina nanoparticles in aluminum‐aluminum bonded joints: Mechanical properties, lap shear strength, and thermal stability

Enhancing Self-Healing and Adhesion Bonding Properties: Investigating the Promising Potential of Ce-ZIF8 MOF Hybrid Thin Films as pH-Responsive Nanocoatings

Physical Properties of Hybrid Epoxy Composites Reinforced with Carbon Fiber and Ceramic Particles

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