Designing for Softness in Semiconducting Conjugated Polymers

Hsu, Nathan Sung Yuan; Lin, Angela; Tran, Helen

doi:10.1021/accountsmr.2c00243

Cited by 2 publications

(2 citation statements)

References 12 publications

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“…This type of well-organized side-chain packing has rarely been achieved in literature ( 47 ). Recent studies have suggested that ordered alkyl side-chain packing could greatly improve the mechanical strength of CP films ( 48 , 49 ). We also performed transmission electron microscopy and small-angle x-ray scattering (SAXS) to confirm the fibers’ microstructures to exclude other possible mechanisms (fig.…”

Section: Resultsmentioning

confidence: 99%

Continuous production of ultratough semiconducting polymer fibers with high electronic performance

Zhang,

Li,

Xiong

et al. 2024

Sci. Adv.

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Conjugated polymers have demonstrated promising optoelectronic properties, but their brittleness and poor mechanical characteristics have hindered their fabrication into durable fibers and textiles. Here, we report a universal approach to continuously producing highly strong, ultratough conjugated polymer fibers using a flow-enhanced crystallization (FLEX) method. These fibers exhibit one order of magnitude higher tensile strength (>200 megapascals) and toughness (>80 megajoules per cubic meter) than traditional semiconducting polymer fibers and films, outperforming many synthetic fibers, ready for scalable production. These fibers also exhibit unique strain-enhanced electronic properties and exceptional performance when used as stretchable conductors, thermoelectrics, transistors, and sensors. This work not only highlights the influence of fluid mechanical effects on the crystallization and mechanical properties of conjugated polymers but also opens up exciting possibilities for integrating these functional fibers into wearable electronics.

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Section: Resultsmentioning

confidence: 99%

Continuous production of ultratough semiconducting polymer fibers with high electronic performance

Zhang,

Li,

Xiong

et al. 2024

Sci. Adv.

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show abstract

“…PDMS allows for extensive strain application in thin films. Such a technique is commonly reported for studying mechanical deformation of confined thin films. − The use of any substrate for the mechanical testing of a thin film can alter mechanical behaviors. For example, a soft substrate can introduce a strong film–substrate adhesion force, and a stiff substrate can prevent any out-of-plane deformation.…”

Section: Methodsmentioning

confidence: 99%

Mechanical Deformation of Polymer Blend Thin Films Reinforced with Boron Nitride

Pokhrel,

Christ,

Wilson

et al. 2024

ACS Appl. Polym. Mater.

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Understanding deformation of polymer thin films at various strains is crucial for wide applications, especially the growing organic semiconductor field. Thin films of immiscible polymer blends containing nanoparticles are particularly interesting as the properties (thermal, mechanical, optical) can be controlled by tuning the morphology. However, brittle fracture of these blend thin films with or without nanoparticles can hinder their fabrication, handling, and use. Herein, we fabricate polymer blend thin films with a pseudo-bicontinuous morphology of dispersed glassy polystyrene (PS) and continuous rubbery polyisoprene (PI). Two-dimensional (2D) boron nitride (BN) nanoplatelets are incorporated from 0 to 30 vol %. As-received BN was functionalized with polydopamine and (3-aminopropyl)triethoxysilane (APTES) to enhance dispersion and interfacial adhesion in the polymer matrix. Transmission electron microscopic images show a majority of polydopamine-silane BN (ds-BN) localized in the continuous rubbery PI and a small amount at the interface of PS and PI. Without functionalization, processing defects occurred at 15 vol % ds-BN, but this limit was increased to >25 vol % with functionalization. We then present the deformation of these thin films under uniaxial mechanical testing (tension, compression, and cyclic tests) at 10, 20, and 30% strains by coupling a micromechanical stage with an optical microscope. Most of the deformations observed were recoverable when returning back to 0% strain from the maximum applied strains. PI provides elastic recovery, PS maintains global stiffness, and ds-BN provides a reinforcement effect in the thin films. We found that polymer blend thin films loaded with notably high concentrations of functionalized ds-BN (up to 25 vol %) localized primarily within the continuous PI exhibited mostly recoverable mechanical performance. These findings are valuable in selecting glassy and rubbery polymer thin films loaded with nanoparticles to design resilient thin films for mechanical, thermal, or electrical applications.

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Designing for Softness in Semiconducting Conjugated Polymers

Cited by 2 publications

References 12 publications

Continuous production of ultratough semiconducting polymer fibers with high electronic performance

Continuous production of ultratough semiconducting polymer fibers with high electronic performance

Mechanical Deformation of Polymer Blend Thin Films Reinforced with Boron Nitride

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