Design rule for minimizing thermal resistance in a non~uniformly powered microprocessor

Kaisare, Abhijit; Agonafer, Dereje; Haji-shiekh, A.; Chrysler, G.; Mahajan, Ravi

doi:10.1109/stherm.2006.1625214

Cited by 3 publications

(2 citation statements)

References 8 publications

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“…The attachment consists of base of heat sink, TIM I and TIM II and heat spreader with the different die architecture are used to develop the numerical model. Current authors have developed a numerical model for thermal based optimization of non-uniformly powered microprocerssors and subsequently developed design guidelines for this numerical model for [16,17]. In this paper previously developed design guideline is used as a base line case.…”

Section: Design Approach and Modeling Methodologymentioning

confidence: 99%

Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors

Raju

Kaisare

Agonafer

et al. 2008

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor. However, the integration also introduces a layer of complexity in the thermal design and management of microprocessors. As a direct result of functional integration, the power map on a microprocessor is highly non-uniform and the assumption of a uniform heat flux across the chip surface has been shown to be invalid post Pentium II architecture. The active side of the die is divided into several functional blocks with distinct power assigned to each functional block. A lot of work has been done addressing this issue with a need of thermally aware computer architecture with a concurrent design approach based on thermal and device clock performance. Previous work has been done to minimize the thermal resistance of the package by optimizing the distribution of the non-uniformly powered functional blocks with different power matrices. The study also provided design guidelines to minimize thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor. This analysis, however, had no constraints placed on the redistribution of functional blocks regarding the maximum separation of any 2 (or more) functional blocks to satisfy electrical timing and compute performance requirements.In this study, numerical model is developed that utilizes multi-objective optimization consists of redistribution of functional blocks to both improve device performance and thermal performance. Previously developed design guideline for thermal optimization is used as a base line case. This baseline case is embedded into computer architecture (floor Plan) to develope a compact model satisfying both electrical and thermal performance. Constraints for the electrical optimization are regarding the maximum separation of any 2 (or more) functional blocks. Once positioning of the functional blocks is carried out, thermal optimization of these nonuniformly powered functional blocks is carried out to minimize thermal resistance. This process is repeated until you get both improve device performance and thermal performance for the non-uniformly powered microprocessor. Finally recommendations are provided for an architecture design regarding maximum separation of functional block with minimum thermal resistance.

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Section: Design Approach and Modeling Methodologymentioning

confidence: 99%

Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors

Raju

Kaisare

Agonafer

et al. 2008

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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“…Thermoelectric devices have very good aspect ratio that fits in a very compact space. Kaisare et.al [13] considered a heat transfer coefficient of 1200 W/m 2 K to cool various chip power maps. In a desktop PC using air cooling attaining a heat transfer coefficient of that value will require a huge heat sink of a very high conductivity material.…”

Section: Thermoelectric Device For Hot Spot Coolingmentioning

confidence: 99%

CFD modeling of a thermoelectric device for electronics cooling applications

Lakhkar

Hossain

Agonafer

2008

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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Increased power density in electronics systems is limiting the ability of air cooling to provide adequate cooling for the components in the systems. Thermoelectric cooling are solid state and highly reliable devices that can be used as either refrigeration or heat pump. The use of thermoelectric device for hot spot cooling has attracted significant research. Under specific conditions, a well-selected thermoelectric device can act as an enhancement for air cooling devices. A Thermoelectric device pumps heat from the cold to hot side, this direction is controlled by the voltage that is applied across the thermoelectric device. If the voltage is applied in opposite direction, the same thermoelectric cooler acts as a thermoelectric heater.In this paper, thermoelectric is used to study as a cooling device. A numerical test bench was set up in Icepak TM . The power applied to thermoelectric, current supplied to thermoelectric and G factor were varied to find out the effect of each of these factors on the performance of the thermoelectric. The performance is evaluated by package temperature. In this study it was revealed that thermoelectric is not only used as a hot spot cooling solution but also can be used as a primary solution too. This study is mainly aimed for high end processors used in applications such as gaming.

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