Design, Preparation and Characterization of Flexible Ultra High Frequency (UHF) Antennas Based on Polyether Ether Ketone (PEEK) Films

Manufacture of complex pattern flexible copper microcircuits based on silver seeds through chemical growth welding

“…Compared with the traditional flexible copper microcircuit based on liquid ink or laser reduction, the resistivity of 200-0.5-Ag/Cu also reached a matching value, and it was in the middle level. [13][14][15][16][17][18][19][20][21][22][23][24]55 Fig. 10(c) and (d) further validate this result with five LED lights in series.…”

“…Compared with the traditional flexible copper microcircuit based on liquid ink or laser reduction, the resistivity of 200-0.5-Ag/Cu also reached a matching value, and it was in the middle level. 13–24,55…”

“…[9][10][11][12] Therefore, the electroless plating at near room temperature shows unusual potential. [13][14][15][16][17][18][19][20][21][22][23] The chemical copper plating process generally involves three steps: the modification of flexible substrates, the reduction of catalytic seeds, and the growth of copper microcircuits. 16,18,[24][25][26] Chen et al 27 modified polyimide (PI) films using a strong alkaline solution, and subsequently printed Cu(II) ink and reductive ink respectively to form copper nanoparticle catalytic patterns.…”