Design optimization of diamond disk pad conditioners

Baisie, Emmanuel A.; Li, Z. C.; Zhang, X. H.

doi:10.1007/s00170-012-4480-x

Cited by 23 publications

(8 citation statements)

References 23 publications

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“…( 13) i.e., (15) where is the operator of rounding a number to the nearest integer (with the borderline case 0.5 rounding up according to Eqs. (8)(9)). The approach based on the parametric mapping space naturally avoids the complexities of scanning all regions to find where a trajectory point is located, and hence is efficient, regardless of the collocation grid numbers.…”

Section: Collocation Grid Methods With Parametric Mapping Spacementioning

confidence: 99%

“…It machines a new pad to create sufficient asperities to hold the grits and restore the asperities by removing the glazing effect during the CMP process. Instead of old designs with randomly distributed diamonds, the latest generation designs of conditioners have a regular distribution of diamonds [9][10][11], e.g., the designs illustrated in Fig. 1(c), aiming at achieving better control of the conditioning process such that the pad surface can be better maintained, and the pad life can be extended.…”

Section: Introductionmentioning

confidence: 99%

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Some numerical aspects in simulating pad conditioning coverage and density for long time conditioning process

Wang¹,

Liu²,

Zhang³

et al. 2022

Asian Society for Precision Engineering and Nanotechnology (ASPEN 2022)

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Section: Collocation Grid Methods With Parametric Mapping Spacementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Some numerical aspects in simulating pad conditioning coverage and density for long time conditioning process

Wang¹,

Liu²,

Zhang³

et al. 2022

Asian Society for Precision Engineering and Nanotechnology (ASPEN 2022)

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“…Baisie et al [10] also investigated different patterns of grain distributions on the conditioner surfaces to optimize the conditioning processes. Their research concluded that the sweeping profile of the conditioner affected the pad profile [11].…”

Section: Literature Reviewmentioning

confidence: 99%

Analysis and improvement of the pad wear profile in fixed abrasive polishing

Nguyen

Zhong

Tian

2015

Int J Adv Manuf Technol

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Fixed abrasive polishing has some advantages in generating good planarization surfaces with low defects. The surfaces after polishing have better uniformity, and the material removal rate is much higher than that of the traditional chemical mechanical polishing using loose abrasives. One of the most important factors that have significant effects on the uniformity of the polished surface is the pad wear profile. The pad wear profile after a long time of polishing is almost concave, and it has been challenging to create a flat surface. Therefore, there is a requirement for creating a better pad wear profile to improve quality of machined surfaces in chemical-mechanical polishing processes. In this paper, kinematic aspects of the effects of operation parameters on the pad wear profile are investigated, combining with conditioner sizes, pattern, and positions. Based on that, a new model, including new designs of the conditioner and pad, is proposed. This new model has created a convex pad wear profile instead of a concave one. According to the result of the new model, the pad shape after the conditioning process is more uniform than the old one conditioned by the old model. The result was validated by an algorithm which was validated by the experiments reported in our previous paper.

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“…were developed. At present, CMP is a key fabrication route for the modern semiconductor process [9,10]. However, high efficiency and high uniformity of surface polishing with traditional CMP method is found to be difficult to achieve.…”

Section: Introductionmentioning

confidence: 99%

An experimental investigation of flat polishing with dielectrophoretic (DEP) effect of slurry

Zhao

Deng

Yuan

et al. 2016

Int J Adv Manuf Technol

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Dielectrophoresis polishing (DEPP) is a novel flat polishing technology which utilizes the dielectrophoretic (DEP) effect to reduce the centrifugal force on the slurry and to obtain a higher polishing efficiency. The mechanism of the DEPP was analyzed in this paper; the motion of slurry being acted upon by DEP force in non-uniform electric field was captured in real-time with a specially designed video recording system to show the influence of electric field intensity and frequency upon DEP force. DEPP and traditional CMP were investigated. These processes were carried out in sequence on the same machine with the same slurry. Compared with traditional CMP, the efficiency of DEPP was improved by about onefold and the better surface uniformity of silicon wafer was obtained. The final surface roughness Ra of silicon wafer was measured at 1.2 nm.

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Design optimization of diamond disk pad conditioners

Cited by 23 publications

References 23 publications

Some numerical aspects in simulating pad conditioning coverage and density for long time conditioning process

Some numerical aspects in simulating pad conditioning coverage and density for long time conditioning process

Analysis and improvement of the pad wear profile in fixed abrasive polishing

An experimental investigation of flat polishing with dielectrophoretic (DEP) effect of slurry

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