Design Optimization of a Thermoelectric Cooling Module Using Finite Element Simulations

Abid, Мuhammad; Somdalen, Ragnar; Rodrigo, Marina Sancho

doi:10.1007/s11664-018-6369-4

Cited by 9 publications

(2 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The relationship between the actual cooling performance of TEC and the input current is basically the same as the relationship between the cooling capacity and input current reported in the literature. [ 36,37 ] Based on the results, we can say that the relationship between T and I actually means that the cooling capacity of the TEC device first increases and then decreases with the increase in I . The trend of quadratic function presented by the simulation results fits quite well with that of Equation (), T ( x ).…”

Section: Resultsmentioning

confidence: 94%

Numerical Simulation and Structural Optimization of Multi‐Stage Planar Thermoelectric Coolers

Nie

Jiang

Sang

et al. 2020

Physica Status Solidi (a)

View full text Add to dashboard Cite

How to efficiently dissipate the heat of a large-area hot source is an urgent problem to be solved in the thermal management field of electronic devices. Herein, multi-stage planar thermoelectric coolers (TECs) oriented to the efficient planar heat dissipation for large-area hot source are designed, and a comprehensive numerical analysis focusing on the cooling performance of the coolers for a heat source is performed by the finite-element methods. The effect of input current, thickness of thermoelectric legs, stage numbers in heat transfer area, numbers of p-n pair in each stage, heat resistance between each stage, and contact status between heat sources and coolers are studied. The results show that high cooling performance of the coolers relies on an optimized input current, large thickness of thermoelectric legs, optimized stage number and number of p-n pair, and low heat resistance between each stage and between heat sources and coolers. The optimized multi-stage planar TEC can realize a maximum cooling temperature difference of 8.2 K. This work indicates that the multi-stage planar TECs can have potential application in thermal management of electronic devices.

show abstract

Section: Resultsmentioning

confidence: 94%

Numerical Simulation and Structural Optimization of Multi‐Stage Planar Thermoelectric Coolers

Nie

Jiang

Sang

et al. 2020

Physica Status Solidi (a)

View full text Add to dashboard Cite

show abstract

“…Huang et al [13] selected the number of thermoelectric legs, leg height and fill ratio of the thermoelectric pairs as optimization variables and used a simplified conjugated-gradient algorithm to obtain the maximum cooling capacity of the TEC. Abid et al [14] altered the height and cross-sectional area of the legs to optimize cooling performance of TECs by simulation and experimental verification. Gong et al [15] found a smaller leg height and larger cross-sectional area of the leg are conducive to enhancing cooling performance and reliability of rectangular TECs.…”

Section: Introductionmentioning

confidence: 99%

Cooling and Mechanical Performance Analysis of a Trapezoidal Thermoelectric Cooler with Variable Cross-Section

Zhang

et al. 2020

Energies

View full text Add to dashboard Cite

In this study, a full-scale three-dimensional trapezoidal thermoelectric cooler model is constructed to study its cooling performance and mechanical reliability using finite element simulation. Temperature dependent material properties are considered in this work. The boundary conditions similar to those in a real experimental environment are applied. The effects of the input electrical current and geometry of the thermoelectric leg on the cooling performance and reliability of a trapezoidal thermoelectric cooler are analyzed, and a comparison is made with a rectangular thermoelectric cooler. The results indicate that increasing the leg height and the variable cross-sectional design of the leg can improve the cooling performance of the trapezoidal thermoelectric cooler. Compared to the original rectangular thermoelectric cooler, the minimum chip temperature was reduced by 0.87% under the trapezoidal thermoelectric cooler with optimized geometry. Furthermore, increasing the leg height enhances the mechanical reliability of the trapezoidal thermoelectric cooler, while the trapezoidal design of the leg reduces its mechanical reliability. The maximum von Mises stress of the leg for the trapezoidal thermoelectric cooler with optimal cooling performance increased by 40.1%. The results of this work provide useful guidance for the structural design of trapezoidal thermoelectric coolers.

show abstract

Optimization and Experimental Validation of a Modular Thermoelectric Heat Pump System for a Premature Baby Incubator

Yeler

Koseoglu

2020

Journal of Elec Materi

View full text Add to dashboard Cite

Design Optimization of a Thermoelectric Cooling Module Using Finite Element Simulations

Cited by 9 publications

References 34 publications

Numerical Simulation and Structural Optimization of Multi‐Stage Planar Thermoelectric Coolers

Numerical Simulation and Structural Optimization of Multi‐Stage Planar Thermoelectric Coolers

Cooling and Mechanical Performance Analysis of a Trapezoidal Thermoelectric Cooler with Variable Cross-Section

Optimization and Experimental Validation of a Modular Thermoelectric Heat Pump System for a Premature Baby Incubator

Contact Info

Product

Resources

About