Design optimization and fabrication of a novel structural piezoresistive pressure sensor for micro-pressure measurement

Li, Chuang; Cordovilla, Francisco; Ocaña, José L.

doi:10.1016/j.sse.2017.09.012

Cited by 19 publications

(9 citation statements)

References 31 publications

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“…c Comparison of the von Mises stresses of the three structure types. d Four-beam-bossed-membrane (FBBM) structure (front and back review) 50 . e Back review of FBBM 50 .…”

Section: Minute Differential Pressure Sensorsmentioning

confidence: 99%

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Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Han,

Huang,

et al. 2023

Microsyst Nanoeng

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Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based pressure sensors have been widely used for decades, new trends in pressure sensors, including higher sensitivity, higher accuracy, better multifunctionality, smaller chip size, and smaller package size, have recently emerged. The demand for performance upgradation has led to breakthroughs in sensor materials, design, fabrication, and packaging methods, which have emerged frequently in recent decades. This paper reviews common new trends in MEMS pressure sensors, including minute differential pressure sensors (MDPSs), resonant pressure sensors (RPSs), integrated pressure sensors, miniaturized pressure chips, and leadless pressure sensors. To realize an extremely sensitive MDPS with broad application potential, including in medical ventilators and fire residual pressure monitors, the “beam-membrane-island” sensor design exhibits the best performance of 66 μV/V/kPa with a natural frequency of 11.3 kHz. In high-accuracy applications, silicon and quartz RPS are analyzed, and both materials show ±0.01%FS accuracy with respect to varying temperature coefficient of frequency (TCF) control methods. To improve MEMS sensor integration, different integrated “pressure + x” sensor designs and fabrication methods are compared. In this realm, the intercoupling effect still requires further investigation. Typical fabrication methods for microsized pressure sensor chips are also reviewed. To date, the chip thickness size can be controlled to be <0.1 mm, which is advantageous for implant sensors. Furthermore, a leadless pressure sensor was analyzed, offering an extremely small package size and harsh environmental compatibility. This review is structured as follows. The background of pressure sensors is first presented. Then, an in-depth introduction to MEMS pressure sensors based on different application scenarios is provided. Additionally, their respective characteristics and significant advancements are analyzed and summarized. Finally, development trends of MEMS pressure sensors in different fields are analyzed.

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“…c Comparison of the von Mises stresses of the three structure types. d Four-beam-bossed-membrane (FBBM) structure (front and back review) 50 . e Back review of FBBM 50 .…”

Section: Minute Differential Pressure Sensorsmentioning

confidence: 99%

“…d Four-beam-bossed-membrane (FBBM) structure (front and back review) 50 . e Back review of FBBM 50 . f Stress distribution curve of the path 50 .…”

Section: Minute Differential Pressure Sensorsmentioning

confidence: 99%

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Han,

Huang,

et al. 2023

Microsyst Nanoeng

View full text Add to dashboard Cite

show abstract

“…Sensors with different mechanisms have their own advantages and limitations in pressure sensing range, sensitivity, response time, working frequency, array integration and other aspects, which make them suitable for different applications (Ji et al , 2016). For example, a piezoresistive sensor with a four-beams-bossed-membrane (FBBM) structure that consisted of four short beams and a central mass to measure micropressure is sensitive to 4.65 mV/V/kPa in the operating range of 0–5 kPa at room temperature and can measure absolute micropressures up to 5 kPa, however, it suffers from hysteresis and therefore has poor frequency response characteristics (Li et al , 2018). A capacitive sensor, whose structure is based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured, has good frequency response, with linear sensitivity of 57,640 Hz/N and fluctuation of 10 mN, while it is susceptible to noise, so complex electronic devices are needed for filtering (Mitsutoshi et al , 2018).…”

Section: Introductionmentioning

confidence: 99%

Design of magnetostrictive tactile sensor for depth detection

Weng

Luo

et al. 2023

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Purpose This paper aims to design a magnetostrictive tactile sensor for surface depth detection. Unlike the human finger, although most tactile sensors have high sensitivity to pressure, they cannot detect millimeter-level depth information on the surface of objects precisely. To enhance the ability to detect surface depth information, a piezomagnetic sensor combining inverse magnetostrictive effect and bionic structure is developed in this paper. Design/methodology/approach A magnetostrictive tactile sensor based on Galfenol [(Fe83Ga17)99.4B0.6] is designed and studied for surface depth measurement. The optimal structure of the sensor is determined by experiment and theory. The test platforms for static and dynamic characteristics are set up. The static and the dynamic sensing performance of the sensor are studied experimentally. Findings The sensor can detect 0–2 mm depth change with a sensitivity of 91.5 mV/mm. A resolution of 50 µm can be achieved in the depth direction. In 50 cycles of loading and unloading tests, the maximum error of the sensor output voltage amplitude is only 2.23%. Originality/value The sensor can measure the depth information of object surface precisely with good repeatability through sliding motion and provide reference for object surface topography detection.

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“…Zhang et al [ 5 ] introduced a novel plastic packaging for MEMS pressure sensor which suggested that the adhesive should be chosen for lower thickness and larger Young’s modulus to make better stability. Li et al [ 6 ] designed a novel piezoresistive pressure sensor with a four-beams-bossed-membrane structure which could improve both sensitivity and linearity. Wang et al [ 7 ] introduced an acoustic pressure sensor with an integrated vacuum cavity that could measure pressure without an external package.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor

Zhang

et al. 2021

Sensors

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Thermal stress is one of the main sources of micro-electro-mechanical systems (MEMS) devices error. The Wheatstone bridge is the sensing structure of a typical piezoresistive MEMS pressure sensor. In this study, the thermal stress induced by potting adhesive in MEMS pressure sensor was investigated by experiments, calculated by analytics and analyzed by simulations. An experiment system was used to test the sensor at different air pressures and temperatures. The error becomes greater with the decrease in pressure. A set of novel formulas were proposed to calculate the stress–strain on Wheatstone bridge. The error increases with the temperature deviating from 25 °C. A full-scale geometric model was developed, and finite element simulations were performed, to analyze the effect of the stress on MEMS pressure sensor induced by different temperatures and thicknesses of potting adhesive. Simulation results agree well with the experiments, which indicated that there is a 3.48% to 6.50% output error in 0.35 mm potting adhesive at 150 °C. With the thickness of potting adhesive increasing, the variations of output error of the Wheatstone bridge present an N-shaped curve. The output error meets a maximum of 5.30% in the potting adhesive of 0.95 mm and can be reduced to 2.47%, by increasing the potting adhesive to 2.40 mm.

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Design optimization and fabrication of a novel structural piezoresistive pressure sensor for micro-pressure measurement

Cited by 19 publications

References 31 publications

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Design of magnetostrictive tactile sensor for depth detection

Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor

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