Design of very transparent fluoropolymer resists for semiconductor manufacture at 157 nm

Feiring, Andrew E.; Crawford, M. K.; Farnham, William B.; Feldman, Jerald; French, Roger H.; Leffew, Kenneth W.; Петров, В. А.; Schadt, Frank L.; Wheland, Robert C.; Zumsteg, F. C.

doi:10.1016/s0022-1139(03)00075-7

Cited by 36 publications

(34 citation statements)

References 16 publications

(23 reference statements)

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“…We also expected that these substrates would have higher shear adhesion in air and in water than previous results on PTFE because of the reduction of roughness in this study [19][20][21][22][23]. Our second hypothesis was that shear adhesion will vary based on the degree of fluorination, where a fully fluorinated substrate ( perfluorinated, such as fluorinated ethylene propylene (FEP)) will have lower shear adhesion values in air and in water than a partially fluorinated substrate (such as ethylene tetrafluoroethylene (ETFE)) [24,25]. Likewise, we hypothesized that our control, non-fluorinated substrate, will have no difference in shear adhesion in water and in air, corresponding to our previous results on hydrophobic, non-fluorinated substrates.…”

Section: Introductionmentioning

confidence: 69%

Adhesive interactions of geckos with wet and dry fluoropolymer substrates

Stark

Dryden

Olderman

et al. 2015

J. R. Soc. Interface.

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Fluorinated substrates like Teflon w (poly(tetrafluoroethylene); PTFE) are well known for their role in creating non-stick surfaces. We showed previously that even geckos, which can stick to most surfaces under a wide variety of conditions, slip on PTFE. Surprisingly, however, geckos can stick reasonably well to PTFE if it is wet. In an effort to explain this effect, we have turned our attention to the role of substrate surface energy and roughness when shear adhesion occurs in media other than air. In this study, we removed the roughness component inherent to commercially available PTFE and tested geckos on relatively smooth wet and dry fluoropolymer substrates. We found that roughness had very little effect on shear adhesion in air or in water and that the level of fluorination was most important for shear adhesion, particularly in air. Surface energy calculations of the two fluorinated substrates and one control substrate using the Tabor-Winterton approximation and the Young-Dupré equation were used to determine the interfacial energy of the substrates. Using these interfacial energies we estimated the ratio of wet and dry normal adhesion for geckos clinging to the three substrates. Consistent with the results for rough PTFE, our predictions show a qualitative trend in shear adhesion based on fluorination, and the quantitative experimental differences highlight the unusually low shear adhesion of geckos on dry smooth fluorinated substrates, which is not captured by surface energy calculations. Our work has implications for bioinspired design of synthetics that can preferentially stick in water but not in air.

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Section: Introductionmentioning

confidence: 69%

Adhesive interactions of geckos with wet and dry fluoropolymer substrates

Stark

Dryden

Olderman

et al. 2015

J. R. Soc. Interface.

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“…P-acetoxystyrene (AcOST), which has been employed in the past as a key component in 248-nm photoresists [68], exhibited the best controlling ability based on the lowest dispersity ( � � ⁄ ~ 1.29) at a concentration as low as 5 mol% in the feed. Pentafluorostyrene (PFS), also offering relatively good control ( � � ⁄ ~ 1.47 and 1.31 for 5 and 10 mol% in the feed, respectively), is of interest, because fluorinated polymers have been shown to be good candidates for both 157-nm and 193-nm photoresists, due to their low absorption, good etch resistance properties [69][70][71][72][73] and high hydrophobicity [74,75], which is especially important in immersion lithography. 2-vinyl naphthalene (VN) was also an effective co-monomer in being able to produce copolymers with low dispersities ( � � ⁄~ 1.3) with as low as 5 mol% in the feed.…”

Section: Characterization Of Nlam/x Statistical Copolymersmentioning

confidence: 99%

Synthesis of Narrow Molecular Weight Distribution Norbornene-Lactone Functionalized Polymers by Nitroxide-Mediated Polymerization: Candidates for 193-nm Photoresist Materials

Wang

Marić

2014

Polymers

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Abstract:One hundred ninety three-nanometer candidate photoresist materials were synthesized by nitroxide-mediated polymerization (NMP). Statistical copolymerizations of 5-methacryloyloxy-2,6-norboranecarbolactone (NLAM) with 5-10 mol% of controlling co-monomers (which are necessary for controlled polymerizations of methacrylates by NMP with the initiator used) in the feed, such as styrene (ST), p-acetoxystyrene (AcOST), 2-vinyl naphthalene (VN) and pentafluorostyrene (PFS), using the unimolecular BlocBuilder ® initiator in 35 wt% dioxane solution at 90 °C were performed. As little as 5 mol% controlling comonomer in the feed was demonstrated to be sufficient to lead to linear evolution of number average molecular weight � with respect to conversion up to 50%, and the resulting copolymers had dispersities � � ⁄ of ~1.3 in most cases, an attractive feature for reducing line width roughness (LWR) in photoresists. The copolymers generally showed relatively low absorbance at 193 nm, comparable to other 193-nm candidate photoresists reported previously, despite the inclusion of a small amount of the styrenic co-monomers in the copolymer. OPEN ACCESSPolymers 2014, 6 566

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“…The polymer also functions to control solution viscosity. Another function is to support film forming and to increase mechanical properties of resulted photoresist liquid 11 . The photoresist appplications in microelectronic industry range very wide area.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Phenolic-Based Resist Materials for Photolithography

Sutikno¹,

Hakim²,

Sugianto³

2016

Orient. J. Chem

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Phenol-based photoresist for photolithography application is successfully developed in this research namely by mixing phenolic resin with ethanol solvent and sodium acetate 3-hydrate 30% of phenolic resin mass. Novolac phenolic resin is made by mixing formaldehyde and phenol in mol ratio 2,8:1 catalyzed using NaOH. Phenolic resin is made at heating temperature of 85°C and stirring rotation speed of 1000 rpm. Photoresist thin film is spincoated on the glass substrate and prebaked on the hotplate at 95°C for 60 s. The research result shows that microstructures of resist films which are manufactured of resol phenolic resin seem more homogeneous than that of novolac phenolic resin. The maximum absorbance is in the wavelength range of 380-500 nm, its density and viscosity are 1,41 g/ml and 198 centipoise, respectively.

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Design of very transparent fluoropolymer resists for semiconductor manufacture at 157 nm

Cited by 36 publications

References 16 publications

Adhesive interactions of geckos with wet and dry fluoropolymer substrates

Adhesive interactions of geckos with wet and dry fluoropolymer substrates

Synthesis of Narrow Molecular Weight Distribution Norbornene-Lactone Functionalized Polymers by Nitroxide-Mediated Polymerization: Candidates for 193-nm Photoresist Materials

Synthesis of Phenolic-Based Resist Materials for Photolithography

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