Design of Novel Highly Integrated Passive Devices for Digital Broadcasting Satellite / 802.11 Home Networking Solution in Liquid Crystal Polymer (LCP) Based Organic Substrates

Abstract

The use of high performance Integrated Passive Devices (IPD) allows an optimum solution in the tradeoff between integration and flexibility for design modification. The paper presents the integration of sub-circuits into IPD's for WLAN and distributed broadcasting satellite (DBS) applications on Liquid Polymer Crystal (LCP)-based organic substrate technology. An integrated diplexer-coupler-harmonic filter for dual-band WLAN applications and a diplexer-balun chipset for DBS applications are presented. The WLAN IPD measures 5x6mm, exhibits directivities of 27dB and 16dB in the 2.4GHz and 5GHz band, and provides 45dB of second harmonic rejection. The DBS diplexer provides 45dBc rejection. Finally, the 2xl.25mm DBS balun utilizing high-inductive coupling shows a measured amplitude and phase balance of 0.5dB and 50 and a minimum return loss of 10dB.

Advanced Microwave Circuits and Systems

“…Moreover, low-k materials with a low loss are preferable for use in the insulation materials between the coil traces. A liquid crystal polymer (LCP) possessing low and stable dielectric constant and loss tangent up to a high frequency is attractive for use as a PCB insulation material, especially for embedded inductor applications at high frequency (Lu H. et al, 2007;Stratigos J., 2007;Govind V. et al, 2006). …”

“…Based on HiDTC (high-density-trench capacitor) architecture, a 35 nF/mm 2 MIM capacitor has been developed with an Al 2 O 3 dielectric of 20 nm. Embedded inductors in an organic subatrate offering an inductance of up to 30 nH have been reported (Govind V. et al, 2006). LTCC are usefule for integating inductors less than 10nH.…”

Design of High-performance Wilkinson Power Divider on SI-GaAs Substrate using Integrated Passive Technology

“…Radio transmitter modules for cellular phones continue to shrink in die size and cost, requiring novel approaches to integrate the numerous passive elements of the radio front-end. Many functional blocks, such as harmonic filters, couplers, baluns, and power combiners/dividers, in the RF modules, can be realized using IPD technology [5][6][7][8][9]. Figure 1 indicates the IPD design methodology widely used in today's RF application sections, due to the IPDs generally being fabricated using standard wafer fabrication technologies, such as thin film and photolithography processing.…”

High Performance and Compact Balanced-Filter Design for WiMAX Front-End Modules (FEM) Using LCP-Based Organic Substrates

“…Low Temperature Co-fired Ceramic (LTCC) [3] is the prevalent choice for the implementation of surface mount RF components. However, ceramic components have cost and reliability issues [4]. This paper presents the design and implementation of novel integrated RF FEM for WiMAX application using a Liquid Crystalline Polymer (LCP) based multilayer organic laminate technology.…”