Design of miniaturized RF SAW duplexer package

Abstract

This paper provides a comprehensive methodology for accurate analysis and design of miniaturized radio frequency (RF) surface acoustic wave (SAW) duplexer package. Full-wave analysis based on the three dimensional (3-D) finite element method (FEM) is applied to get the package model. The die model is obtained by combining the parasitics and acoustics models. The modeling of bonding wire is also discussed. The models of package, die, and bonding wires are assembled together to get the total response. Based on this methodology, several novel ideas are proposed to significantly improve the isolation. Simulation and measurement results are compared, and excellent agreement is found. The technique developed in this paper reduces the design cycle time greatly and can be applied to various RF SAW device packages.