Design of miniaturized RF SAW duplexer package

Abstract

This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RF SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and measurement results are compared and excellent agreement is found. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RF SAW device packages.