“…Compared to other techniques (e.g., lithography, electrochemical machining, template, plasma, etc. ), the laser processing technology has a wider application in producing surface microstructures to improve interfacial bonding strength due to high efficiency, high flexibility, environmental friendliness, etc. − Nevertheless, the formation of mechanical interlocking is always confronted with one intrinsic problem related to the interfacial wetting of the polymer on surface microstructures, , and insufficient wetting would result in interfacial defects and a significant decrease in interfacial bonding strength, which is one critical problem restricting the application of mechanical interlocking that is receiving increasing attention from engineers and researchers . The difficult filling of polymer into laser-produced dimple and groove microstructures are widely reported in recent literature because of a high surface roughness resulting from inappropriate processing parameters. , As a result, the surface microstructures contribute to interfacial bonding strength by the formation of mechanical interlocking, but it is vulnerable to the excessive surface roughness …”