Design of EMI/RFI suppression on LCD panel flexible printed circuit board for smartphones

Yang, Sheng-Fan; Li, Jui-Ni; Guan, Sheng-Wei; Hung, Yu Chun; Huang, Ying-Ruei; Tsai, Ching-Ling

doi:10.1109/apcap.2016.7843281

Cited by 3 publications

(3 citation statements)

References 3 publications

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Section: Design For Emi Immunity Examplementioning

confidence: 99%

“…The boom in flexible and wearable electronics has led to substantial research to investigate related EMI reliability problems, from testing methods [5,6] to EMI designs, particularly on design for EMI immunity of wearables [17,18]. For example, [17] reports circuit routing technique in designing flexible printed circuit board for LCD panels where current return paths and decoupling capacitors were optimized to suppress EMI effects. [18] describes the benefits of using flexible thin films made of graphene multi-walled carbon nanotube (MWCNT) as RF shield layers for enhanced EMI shielding efficiency, which can be applied to various flexible and wearable electronics.…”

Section: Design For Emi Immunity Examplementioning

confidence: 99%

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Design for EMI/ESD Immunity for Flexible and Wearable Electronics

Pan

Hao

et al. 2023

IEEE J. Electron Devices Soc.

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Proliferation of flexible, wearable and portable electronics come with new challenges of system reliability. Particularly, flexible and wearable electronics cause more frequent and are more susceptible to electromagnetic interference (EMI) effects and electrostatic discharge (ESD) failures, and have unique requirements for design-for-reliability (DfR) associated with EMI and ESD immunity to achieve electromagnetic compatibility (EMC) compliance. This paper outlines the key challenges in design for EMI and ESD immunity for wearable microsystems and discusses potential design for EMI/ESD immunity solutions.

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Section: Design For Emi Immunity Examplementioning

confidence: 99%

Section: Design For Emi Immunity Examplementioning

confidence: 99%

Design for EMI/ESD Immunity for Flexible and Wearable Electronics

Pan

Hao

et al. 2023

IEEE J. Electron Devices Soc.

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“…Recent advancements in semiconductor technology have ushered in a new era of printed circuit boards (PCBs) [1]. Among these, flexible PCBs (FPCBs) have emerged as a game-changer due to their remarkable thinness, flexibility, and lightweight attributes [2], making them indispensable components in modern electronic devices like smartphones [3], displays [4], and wearables [5]. However, the growing demand for even slimmer and more integrated FPCBs has presented manufacturing challenges and a pressing need for robust quality control methods.…”

Section: Introductionmentioning

confidence: 99%

Non-destructive quality testing with photoacoustic imaging and optical coherence tomography

Park,

Ahn,

Kim

2024

High-Power Laser Materials Processing: Applications, Diagnostics, and Systems XIII

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Non-destructive testing (NDT) is vital for product safety, quality, and compliance in various industries. It enables early flaw detection, cost-effective maintenance, and customer satisfaction. NDT encompasses technologies like vision testing, radiation testing, ultrasonic testing, and magnetic testing, which are tailored to specific requirements such as environment, size, and material of the specimen. We present concurrent photoacoustic imaging (PAI) and optical coherence tomography (OCT) for non-destructive inspection of printed circuit boards (PCBs). PCBs are integral to electronic products, contributing to their miniaturization and portability. Due to the small size of RLC components within PCBs, highresolution NDT methods are essential. PAI combines optical excitation and ultrasonic detection based on light absorption, while OCT is a purely optical imaging technique based on interference of backscattered signals. By combining PAI and OCT, we can simultaneously obtain complementary information on light absorption and scattering. However, the development of a dual-modality system combining PAI and OCT is challenging due to the opacity of conventional ultrasonic transducers. To overcome this challenge, we have developed an optically transparent ultrasound transducer for coaxial combination of PAI and OCT. Our approach successfully detects anomalies such as internal thin layer delamination and internal wire disconnection that are difficult to visually observe within PCBs, providing high-resolution PA and OCT images. In particular, unlike conventional pure optical imaging methods, PAI and OCT are depth-resolved 3D volumetric images so that internal defects can be investigated through comprehensive information in the depth direction of the sample. This dual-modality using PAI and OCT for NDT holds great promise for inspecting various specimens, including PCBs, and contributes to enhanced quality control and reliability.

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