2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No.04CH37519)
DOI: 10.1109/isscc.2004.1332783
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Design of CMOS for 60GHz applications

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Cited by 115 publications
(34 citation statements)
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“…In simulations the first stage has a conversion loss of about 4 dB, which should be added to the overall gain when comparing to non frequency converting PAs. Other published 60 GHz power amplifiers in CMOS show about 2-4 dB gain per stage [7], [11], [12], which our amplifiers also have in the last stage. For higher gain one or two more stages at 30 GHz or 60 GHz can be added to the PA.…”
Section: Measurement Resultssupporting
confidence: 62%
“…In simulations the first stage has a conversion loss of about 4 dB, which should be added to the overall gain when comparing to non frequency converting PAs. Other published 60 GHz power amplifiers in CMOS show about 2-4 dB gain per stage [7], [11], [12], which our amplifiers also have in the last stage. For higher gain one or two more stages at 30 GHz or 60 GHz can be added to the PA.…”
Section: Measurement Resultssupporting
confidence: 62%
“…High power gain is easier to attain at lower frequencies, [7], [8] show two designs at about 30 GHz having gains of 7-8 dB. Other published 60 GHz power amplifiers in CMOS show about 2-4 dB gain per stage [9]- [11], which our amplifiers also have in the last stage. The 3-dB bandwidth is 5.9 GHz and 6.8 GHz, for the SI and DI.…”
Section: Simulation Resultsmentioning
confidence: 69%
“…Using typical notation for MoM analysis, the discretized electromagnetic (EM) problem is denoted as (1) and this can be expanded in terms of contributions from electric and magnetic currents as (2) where represents an interaction matrix, which measures the interaction between the expansion function and test function . The vectors and represent complex coefficients of the electric and magnetic current density, respectively.…”
Section: Modeling Approachmentioning
confidence: 99%
“…The use of vias is avoided in the measurement setup to minimize manufacturing uncertainties. Since the realization 1 Nelco N9000 PTFE Laminates, Park Electrochemical Corp. 2 Gore Speedboard C Prepreg Data Sheet, W. L. Gore & Associates. of vias requires an additional metallization step in the manufacturing process, the copper thickness increases and therefore, the metallization tolerances increase as well.…”
Section: A Measurement Setupmentioning
confidence: 99%