Design of an ultra-low-power digital processor for passive UHF RFID tags

Wanggen, Shi; Zhang, Yiqi; Li, Xiaoming; Wang, Xianghua; Zhao, Jiachang; Wang, Dan

doi:10.1088/1674-4926/30/4/045004

Cited by 6 publications

(3 citation statements)

References 10 publications

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“…The results showed that around 80% of the total power consumption was dissipated as heat. Since the power dissipated in a CMOS circuit accounts for more than 75% of the power consumption for recent technologies [53], the obtained results are satisfactory.…”

Section: Discussionmentioning

confidence: 64%

Electrothermal analysis of integrated circuits: a realization by infrared thermography

Farrokhi¹

2021

Preprint

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The International Technology Roadmap for Silicon (ITRS) predicted that by the year 2016, a high-performance chip could dissipate as much as 300 W/cm² of heat. Another more noticeable thermal issue in IC's is the uneven temperature distribution. Increased power dissipation and greater temperature variation highlight the need for electrothermal analysis of electronic components. The goal of this research is to develop an experimental infrared measurement technique for the thermal and electrothermal analysis of electronic circuits. The objective of the electrothermal analysis is to represent the behavior of the temperature dependent characteristics of electronic device in near real work condition. An infrared (IR) thermography setup to perform the temperature distribution analysis and power dissipation measurement of the device under test is proposed in this reasearch. The system is based on a transparent oil heatsink which captures the thermal profile and run-time power dissipation from the device under test with a very fine degree of granularity. The proposed setup is used to perform the thermal analysis and power measurement of an Intel Dual Core E2180 processor. The power dissipation of the processor is obtained by calculating and measuring the heat transfer coefficient of the oil heatsink. Moreover, the power consumption of the processor is measured by isolating the current used by the CPU at run time. A three-dimensional fininte element thermal model is developed to simulate the thermal properties of the processor. The results obtained using this simulation is compared to the experimental results from IR thermography. A methodology to perform electrothermal analysis on integrated circuits is introduced. This method is based on coupling a standard electrical simulator, which is often used in the design process, and IR thermography system through an efficient interface program. The proposed method is capable of updating the temperature dependent parameters of device in near real time. The proposed method is applied to perform electrothermal analysis of a power MOSFET to measure the temperature distribution and the device performance. The DC characteristics of the device are investigated. The obtained results indicated that the operating point, I-V characteristics and power dissipation of the MOSFET vary significantly with temperature.

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Section: Discussionmentioning

confidence: 64%

Electrothermal analysis of integrated circuits: a realization by infrared thermography

Farrokhi¹

2021

Preprint

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“…In a modern embedded system circuit the major portion of power is consumed by clock transitions which resulting from the charging and discharging capacitances of load [8]. This problem of clock transitions in any part of circuit can be avoided using different clocking strategies.…”

Section: Background and Motivationmentioning

confidence: 99%

Implementation of embedded RISC processor with dynamic power management for low-power embedded system on SOC

Kumar

Rattan

2015

2015 2nd International Conference on Recent Advances in Engineering &Amp; Computational Sciences (RAECS)

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The SOCs produced nowadays provide a high level of functionality, serve a wide range of applications, while becoming more efficient and cost effective. The complexity of the SOCs is also reaching its peak level. Around 10 to 12 numbers of analog IPs and digital IPs blocks are incorporated into the single SOC. It also supports multiple voltage domains that often simultaneously a combination of internal and external regulation modes. For modern age embedded systems to operate with high range of power and performance, the system must be power aware but not just consume low power. This paper presents the design detail of embedded RISC processor with dynamic power management capability. In this paper, we implemented a RISC processor with power management that keeps on tracking access to I/O devices while processing and power aware techniques within coding that lower the power consumption of system. Paper describes about the proposed system architecture, synthesis and simulation results analysis of the design. The coding is done with verilog-HDL and these coded designs are synthesized and simulated using Xilinx ISE 12.3 (Xilinx ISim simulator) and power calculation is done using Xilinx Xpower analyzer. Keywords-Dynamic voltage scaling (DVS), Dynamic frequency scheduling (DFS), hardware description language (HDL), Reduced Instruction set computer (RISC), system-on-chip (SoC), field programmable gate array (FPGA).

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“…Almost every recent research work concerning passive long range UHF RFID tags uses this communication protocol; e.g. : (Yan et al, 2006;Barnett et al 2007;Man et al, 2007;Ricci et al, 2008;Zhang et al, 2008;Roostaie et al 2008;Wanggen et al 2009). Thus, this chapter is focused in the C1G2 standard.…”

Section: Introductionmentioning

confidence: 99%