“…Multilayer printed circuit board (PCB), low-temperature co-fired ceramics (LTCC), monolithic integrated circuits (MMICs), and CMOS, are among the most common integration technologies for the realization of compact planar baluns and many unique design approaches have been demonstrated to date. These include 180 • power-dividing baluns using cascaded unit cells [7], [8], [9], power division configurations followed by phase inversion [10], [11], [12], [13], [14], [15], and slot line resonator approaches [16], [17], [18], [19], [20], [21]. Although wide FBWs above 150% have been reported with these techniques, most of the resulting baluns have large physical sizes with footprints ∼0.25 λ 2 g or larger.…”