Design of a micro-optical low coherent interferometer array for the characterisation of MEMS and MOEMS

Gastinger, Kay; Haugholt, Karl Henrik; Røyset, A.; Albero, Jorge; Zeitner, Uwe D.; Gorecki, Christophe

doi:10.1007/978-3-642-03051-2_104

Cited by 4 publications

(3 citation statements)

References 6 publications

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“…For example Gastinger et al proposed a white light interferometer sensor array on wafer scale for parallelization of the measurement task. 1 Weckenmann et al proposed another solution to use multiple sensors with different resolutions and fields of view to sample the specimen at several predefined positions and reconstruct a specimen representation from this measurement. 2 A more flexible solution to balance the conflict between resolution and field size has been described initially by Osten et al 3 and Kayser et al 4 and was further developed to detect defects on microlens arrays and MEMS.…”

Section: Introductionmentioning

confidence: 99%

An assistance system for the selection of sensors in multi-scale measurement systems

Burla

Haist

Lyda

2010

Interferometry XV: Applications

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Optical inspection using multi-sensor multi-scale systems requires the selection of proper sensors, their parameters (e.g. resolution, N.A, lighting conditions), and measurement strategies. We propose an assistance system that automatically selects the suitable sensors and their parameters for an inspection specification. The specimen and the defects are described based on their properties (e.g. geometry, material etc) to the assistance system. The system then uses different "sub-assistants", each designed for a specific measurement technique, to recommend the most suitable measurement setups. The system and initial results for fringe projection techniques are presented.

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Section: Introductionmentioning

confidence: 99%

An assistance system for the selection of sensors in multi-scale measurement systems

Burla

Haist

Lyda

2010

Interferometry XV: Applications

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“…Beim Einsatz hochaufBrought to you by | New York University Bobst Library Technical Services Authenticated Download Date | 7/14/15 8:46 PM lösender Messgeräte würde jedoch aufgrund der begrenzten volumenbezogenen Auflösung optischer Sensoren das Abtasten der gesamten betreffenden Oberfläche zur vollständigen Durchführung der Inspektionsaufgabe viel Zeit benötigen. Um die Messzeit deutlich zu verkürzen, gab es in den vergangenen Jahren unterschiedliche Ansätze: Im Hinblick auf einzelne, fest definierte Inspektionsaufgaben, die auf groẞen Flächen simultan durchgeführt werden sollen, gibt es die Möglichkeit einen einzelnen Sensor mehrfach parallel zu installieren, so dass die Summe aller Messfelder ein groẞes Messvolumen abdecken [3,9]. In anderen Arbeiten wurde Sensorsysteme entwickelt, die simultan an einem Objekt unterschiedliche Merkmale inspizieren können, wie zum Beispiel die Topologie und das gestreute Farbspektrum des Bauteils [12,14].…”

Section: Introductionunclassified

Multisensorisches Messsystem zur dreidimensionalen Inspektion technischer Oberflächen

Keck

Böhm

Knierim

et al. 2014

Tm - Technisches Messen

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Zusammenfassung Um die Fertigungsqualität mechanischer Bauteile aus Kleinserienproduktionen sicherzustellen werden flexible Inspektionssysteme benötigt. Zur Erfüllung dieser Anforderungen wird in diesem Beitrag eine multiskalige Inspektionsstrategie und deren Implementierung an einem Demonstrator vorgestellt. Dieser besteht aus mehreren optischen Sensoren sowie einem Aktoriksystem, das mithilfe einer angepassten Messablaufsteuerung und Regelung zur Inspektion von Unvollkommenheiten an kleinen Bauteilen wie Zahnrädern eingesetzt werden kann.

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“…A multi sensor approach is described in [2] were a white light interferometer sensor array on wafer scale is used for parallelization of the measurement task. This leads to a reduction of the measurement time by the number of sensors in the array.…”

Section: Introductionmentioning

confidence: 99%

Automated multiscale measurement system for MEMS characterisation

et al. 2010

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In former publications we presented an automated multiscale measurement system (AMMS) based on an adaptable active exploration strategy. The system is armed with several sensors linked by indicator algorithms to identify unresolved defects and to trigger finer resolved measurements. The advantage of this strategy in comparison to single sensor approaches is its high flexibility which is used to balance the conflict between measurement range, resolution and duration. For an initial proof of principle we used the system for inspection of microlens arrays. An even higher challenge for inspection systems are modern micro electro-mechanical systems (MEMS). MEMS consist of critical functional components which range from several millimeters down to micrometers and typically have tolerances in sub-micron scale. This contribution is focused on the inspection of MEMS using the example of micro calibration devices. This new class of objects has completely different surface characteristics and features hence it is necessary to adapted the components of the AMMS. Typical defects found on calibration devices are for example broken actuator combs and springs, surface cracks or missing features. These defects have less influence on the optical properties of the surface and the MEMS surface generates more complex intensity distributions in comparison microlense arrays. At the same time, the surface features of the MEMS have a higher variety and less periodicity which reduce the performance of currently used algorithms. To meet these requirements, we present new indicator algorithms for the automated analysis of confocal as well as conventional imaging data and show initial multiscale inspection results.

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Design of a micro-optical low coherent interferometer array for the characterisation of MEMS and MOEMS

Cited by 4 publications

References 6 publications

An assistance system for the selection of sensors in multi-scale measurement systems

An assistance system for the selection of sensors in multi-scale measurement systems

Multisensorisches Messsystem zur dreidimensionalen Inspektion technischer Oberflächen

Automated multiscale measurement system for MEMS characterisation

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