Design method for wafer dicing machine base based on calculations

Abstract

In recent years, the role of semiconductor industry has become crucial for development in various countries. The semiconductor industry mainly consists of three parts: silicon material production, integrated circuit wafer manufacturing, and integrated circuit packaging. This paper focuses on the analysis of the cutting structure of the backend equipment wafer dicing machine in the integrated circuit packaging process. Currently, the mainstream wafer dicing machines utilize two types of cutting methods: laser cutting and mechanical cutting. While laser cutting is necessary for certain materials due to the generation of debris, mechanical cutting using diamond saw blades still offers significant cost savings. In order to achieve optimal design for mechanical wafer dicing machines, this paper presents a design process specifically tailored for such machines that used of mechanical cutting method, taking the example of a vibration-isolated base for a 6-inch wafer dicing machine.