Abstract:We present the FEOL reliability checking flow in advanced technology especially with over drive applications. We check gate bias values obtained from SPICE transient simulation against the maximum allowed value, Vg_max, to make sure robust gate dielectric reliability. We set up HSPICE MOSRA simulation procedure to let designers check the impact of BTI and HCI to each MOSFET device and the circuit performance at End-of-Lifetime (EOL). From HCI degradation analysis from HSPICE MOSRA, we obtained a good correlati… Show more
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