Design for reliability of power electronics modules

Lu, Hua; Bailey, C.; Yin, Chunyan

doi:10.1016/j.microrel.2009.07.055

Cited by 158 publications

(62 citation statements)

References 5 publications

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“…As the thickness of the solder increases, reliability also increases. Figure 3 shows the effect of solder joint on the reliability of an IGBT module; as can be seen, module lifetime increases with increasing thickness of solder [32]:…”

Section: Exact Methodsmentioning

confidence: 99%

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A Comparative Reliability Study of Three Fundamental Multilevel Inverters Using Two Different Approaches

2016

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Abstract:The reliability of power electronic devices and components is very important to manufacturers. In recent years, many researchers have conducted reliability assessments of power electronic devices, yet the reliability of numerous circuits used widely has not been evaluated. This paper presents a comprehensive reliability evaluation of fundamental multilevel inverters. The reliability of the multilevel inverters is analyzed by calculating the mean time to failure for each component. The calculation was performed by two methods (approximate and exact) to achieve better comparisons. The approximate method is similar to the parts count method used in MIL-HDBK-217 reliability standard, and the exact method exhibits the parts stress method. In the exact method, due to the direct relationship between component failure and temperature, we used Matlab Simulink to determine power losses in diodes and switches taking into account the temperature factor. The results determined by the approximate method showed that the three-level cascade H-bridge was the most reliable of the inverters considered. Although the exact method validates those results, and shows that cascade H-bridge (CHB) had a longer lifespan, but the calculated values are different. Therefore, using different approaches for evaluating reliability results in different outcomes.

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Section: Exact Methodsmentioning

confidence: 99%

“…Considering the wide use of semiconductor devices in power electronics, assessing their reliability is essential and imperative [31,32]. For example, the reliability of IGBTs has been assessed and soldering condition has been identified as an important factor in the reliability of the IGBT module.…”

Section: Human Reliabilitymentioning

confidence: 99%

A Comparative Reliability Study of Three Fundamental Multilevel Inverters Using Two Different Approaches

2016

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“…Its relatively low reliability is mainly attributed to its operation feature of dealing with a wide-range random power fluctuations during a long period.Statistics have shown that power converter is one of the most fragile part of the new energy equipment [2]- [5], among them the IGBT modules are also the most fragile part. The failure modes of it can generally be separated into two categories: chip-related failure and packaging-related failure.…”

Section: Failure Modes and Mechanism Of Igbt Modulesmentioning

confidence: 99%

“…IntroductIon P OWER electronic system has high energy conversion efficiency and controllability [1],it has been widely used in aerospace, industrial automation, transportation, renewable energy power generation and other fields which require the highly reliability [2]- [5]. In these fields, the power will fluctuate in a large range [6]- [8], the reliability of power electronic systems with the harsh operating conditions are far less than traditional power equipment.…”

mentioning

confidence: 99%

Review of Power Semiconductor Device Reliability for Power Converters

et al. 2017

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“…Malfunctions of PECs cause failures to electrical/control systems within WECs and contribute to approximately 41% of the total causes [3]. Temperature is one of the common causes and responsible for about 60% of PECs failures [4]. Temperature fluctuations lead to degradation in bonded adjacent layers of these semiconductor devices and eventual failures occur due to the thermal expansion.…”

Section: Introductionmentioning

confidence: 99%

A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

Batunlu

Albarbar

2015

Electronics

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Over the last two decades, various models have been developed to assess and improve the reliability of power electronic conversion systems (PECs) with a focus on those used for wind turbines. However, only few studies have dealt with mitigating the PECs thermo-mechanical effects on their reliability taking into account variations in wind characteristics. This work critically investigates this issue and attempts to offer a mitigating technique by, first, developing realistic full scale (FS) and partial scale (PS) induction generator models combined with two level back-to-back PECs. Subsequently, deriving a driving algorithm, which reduces PEC's operating temperature by controlling its switching patterns. The developed switching procedure ensures minimum temperature fluctuations by adapting the variable DC link and system's frequency of operation. It was found for both FS and PS topologies, that the generator side converters have higher mean junction temperatures where the grid side ones have more fluctuations on their thermal profile. The FS and PS cycling temperatures were reduced by 12 °C and 5 °C, respectively. Moreover, this led to a significant improvement in stress; approximately 27 MPa stress reduction for the FS induction generator PEC.

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Design for reliability of power electronics modules

Cited by 158 publications

References 5 publications

A Comparative Reliability Study of Three Fundamental Multilevel Inverters Using Two Different Approaches

A Comparative Reliability Study of Three Fundamental Multilevel Inverters Using Two Different Approaches

Review of Power Semiconductor Device Reliability for Power Converters

A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

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